Electrical component desoldering and extracting tool

Claim 2

A tool for use in desoldering and extracting from a printed circuit board an integrated circuit module which has rows of metallic terminals at opposite side edges thereof and connector pins extending downwardly from said terminals below the underside of the module; said tool comprising a shank adapted to be connected to and heated by a soldering iron, a metallic plate secured to an end of said shank, and rows of spaced resilient fingers formed integrally with and extending downwardly from opposite side edges of said plate, said rows of fingers being spaced apart sufficiently to receive the module therebetween and to frictionally contact the rows of module terminals with individual fingers juxtaposed against individual terminals whereby to transfer heat through the terminals to their connector pins for melting solder on the latter while the module is in position on the printed circuit board.

Claim 3

A tool for use in desoldering and extracting from a printed circuit board an integrated circuit module which has rows of metallic terminals at opposite side edges thereof and connector pins extending downwardly from said terminals below the underside of the module; said tool comprising a shank adapted to be connected to and heated by a soldering iron, a metallic plate secured to an end of said shank, and rows of fingers formed integrally with and extending downwardly from opposite side edges of said plate, said rows of fingers being adapted to receive a module therebetween and to frictionally contact the rows of module terminals whereby to transfer heat through the terminals to their connector pins for melting solder on the latter while the module is in position on a printed circuit board together with downturned flanges provided at opposite ends of said plate and inturned detents provided at lower edges of said flanges for engaging the underside of a module whereby the latter may be extracted from a printed circuit board by pulling force applied to said shank, said flanges being resiliently flexible to permit disengagement of said detents from the underside of the module when the latter is to be separated from the tool.

Claim 4

A tool for use in desoldering and extracting from a printed circuit board an integrated circuit module which has rows of metallic terminals at opposite side edges thereof and connector pins extending downwardly from said terminals below the underside of the module; said tool comprising a shank adapted to be connected to and heated by a soldering iron, a metallic plate secured to an end of said shank, and rows of fingers formed integrally with and extending downwardly from opposite side edges of said plate, said rows of fingers being adapted to receive a module therebetween and to frictionally contact the rows of module terminals whereby to transfer heat through the terminals to their connector pins for melting solder on the latter while the module is in position on a printed circuit board together with downturned flanges provided at opposite ends of said plate and inturned detents provided at lower edges of said flanges for engaging the underside of a module whereby the latter may be extracted from a printed circuit board by pulling force applied to said shank, said flanges being resiliently flexible to permit disengagement of said detents from the underside of the module when the latter is to be separated from the tool.

Claim 5

The tool as defined in claim 2 which is further characterized in that the vertical dimension of said flanges is such that said detents are spaced downwardly from said plate by a distance greater than the vertical dimension of a module, whereby a space may exist between the top of the module and the plate when the module is engaged at its underside by said detents.

Claim 6

The tool as defined in claim 3 which is further characterized in that said space between the top of the module and said plate is open to the atmosphere through spaces existing between said fingers in each row.