US3629545A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Laser substrate parting
Assignee: AT&T Inc
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Filing: 1967-12-19
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Granted: 1971-12-21
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Expires: 1987-12-19
Abstract
Abstract A laser beam is applied to a substrate to separate the substrate at that portion of the substrate to which the laser beam is applied and the laser beam is displaced relative to the substrate to part or separate the substrate along a path defined by such relative displacement. A localized fracture, which extends entirely through the substrate but which is restricted to the portion of the substrate to which the laser beam is applied, may be generated without deleterious damage to the substrate. By displacing the laser beam along a desired path, the fracture is propagated along the desired path to separate or part the substrate.
Inventors
- 👤 Charles Eckner Graham
- 👤 Robert Miller Lumley
- 👤 David James Oberholzer
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-02 02:54
CPC Classifications
H; H10; H10P; H10P72/00; H10P72/04; H10P72/0428; B; B23; B23K; B23K26/00; B23K26/0006; B23K26/352; B23K26/359; B23K26/36; B23K26/40; C; C03; C03B; C03B33/00; C03B33/09; C03B33/091; H05; H05K; H05K3/00; H05K3/0011; H05K3/0017; H05K3/0026; H05K3/0029; H10N; H10N97/00; H10P34/00; H10P34/40; H10P34/42; B23K2101/00; B23K2101/36; B23K2101/40; B23K2103/00; B23K2103/50; B23K2103/52; B23K2103/56
Claims Analysis
Total Claims: 12
Claim 1
Independent Claim
10 words
The method of claim 1 wherein said substrate is ceramic.
Claim 2
Dependent Claim
10 words
The method of claim 1 wherein said substrate is alumina.
Claim 3
Dependent Claim
10 words
The method of claim 1 wherein said substrate is glass.
Claim 4
Dependent Claim
10 words
The method of claim 1 wherein said substrate is sapphire.
Claim 5
Independent Claim
129 words
A method for separating a first portion of a substrate from a second portion of the substrate, comprising the steps of: applying a focused laser beam to a point on a line which divides said first portion of said substrate from said second portion, said laser beam being applied at a power level sufficient to generate a fracture entirely through said substrate at said point of application, said fracture being substantially restricted in area to said point of application; and displacing said laser beam along said line to propagate said fracture along said line to separate said first and second portions of said substrate the intensity of said beam and the speed of displacement being so controlled that fracture is effected without reliance upon vaporization to generate said fracture.
Claim 6
Dependent Claim
18 words
The method of claim 6 wherein said substrate is positioned at the focal point of said laser beam.
Claim 7
Dependent Claim
10 words
The method of claim 7 wherein said substrate is sapphire.
Claim 8
Dependent Claim
10 words
The method of cLaim 7 wherein said substrate is alumina.
Claim 9
Dependent Claim
36 words
The method of claim 6 wherein said substrate is positioned a fixed distance away from the focal point of said laser. 11 The method of claim 6 wherein said laser beam is focused to a line.
Claim 10
Dependent Claim
10 words
The method of claim 11 wherein said substrate is glass.
Claim 11
Independent Claim
159 words
A method of partitioning an alumina substrate having a planar surface supporting a plurality of individual circuits thereon, which comprises the steps of: applying a laser beam to said planar surface on a section of a predetermined line of partition of said substrate between said individual circuits with sufficient power level to fracture the substrate through said section, said laser beam being applied for sufficient duration and being of sufficient magnitude to heat only a portion of the substrate extending from the top surface to impart a thermal shock of sufficient magnitude to the remaining portion of said substrate to fracture through said substrate without fracturing across the substrate, and displacing said substrate relative to said laser beam along said line of partition to separate the substrate along the path of said relative movement the intensity of said beam and the speed of displacement being so controlled that fracture is effected without reliance upon vaporization to generate said fracture.
Claim 12
Independent Claim
111 words
A method of dividing a substrate constructed of material fracturable by application of a laser beam, which comprises: applying a laser beam on a section of the surface of said substrate at a sufficient power level to extend a local fracture through said section an the underlying substrate but not across the remainder of said substrate, and displacing said laser beam relative to said substrate to extend the fracture across the remainder of the substrate in a path determined by the path of said relative movement the intensity of said beam and the speed of displacement being so controlled that fracture is effected without reliance upon vaporization to generate said fracture.
References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1974-12-20 | 1975-06-21 | 1975-12-21 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1978-12-20 | 1979-06-21 | 1979-12-21 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1982-12-20 | 1983-06-21 | 1983-12-21 | $7700.00 | Window Closed / Lapsed |