US3623219A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Method for isolating semiconductor devices from a wafer of semiconducting material
Assignee: RCA Corp
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Filing: 1969-10-22
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Granted: 1971-11-30
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Expires: 1989-10-22
Abstract
Abstract AN ARRAY OF DEVICES IS FIRST FORMED IN A SILICON WAFER. A PROTECTIVE LAYER OF SILICON NITRIDE IS DEPOSITED ON THE SURFACE OF THE WAFER, AND A GLASS HANDLE BODY HAVING A THERMAL EXPANSION COEFFICIENT CLOSELY MATCHING THAT OF SILICON IS SEALED TO THE SILICON NITRIDE LAYER. THAT PORTION OF THE WAFER BETWEEN ADJACENT DEVICES IS ETCHED AWAY, AND A BODY OF A SOFTENED GLASS WHICH HAS A LIKE EXPANSION COEFFICIENT, BUT IS LESS REFRACTORY THAN THE GLASS HANDLE BODY, IS HOT-PRESSED INTO THE ARRAY OF ISOLATED DEVICES. THE HANDLE BODY IS THEN REMOVED BY ETCHING. D R A W I N G
Inventors
- 👤 Arthur Irwin Stoller
- 👤 William Henry Schilp
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-23 17:34
CPC Classifications
H; H10; H10W; H10W10/00; H10W10/10; H10W10/01; H10W10/011; H10W10/019; H10P; H10P72/00; H10P72/70; H10P72/74; H10P72/743; H10P72/7434; Y; Y10; Y10S; Y10S257/00; Y10S257/926; Y10S438/00; Y10S438/973
Claims Analysis
Total Claims: 0
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References Cited (Backward Citations)
No citation records indexed.
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1974-11-29 | 1975-05-31 | 1975-11-30 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1978-11-29 | 1979-05-31 | 1979-11-30 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1982-11-29 | 1983-05-31 | 1983-11-30 | $7700.00 | Window Closed / Lapsed |