Method of embedding semiconductor chip within a dielectric layer flush with surface

Abstract

Abstract A method of embedding a semiconductor chip within a dielectric bonding layer, normally employed to bond said chip to a dielectric supporting substrate, so that the metallized face of said chip is flush with an extremely smooth surface of the dielectric layer. The present method permits readily made coplanar connections between the chip''s contact electrodes and conductive patterns that may be formed contiguous with the dielectric layer surface. In performing the process, a chip is set upon the layer of dielectric material. A thin sheet of metal is placed over the chip and the surface of the dielectric layer. A platen, the face of which is ground flat to a high degree of smoothness, is pressed down upon the metal sheet in the presence of heat applied to said dielectric layer until the face of the chip becomes flush with the surface of said layer. The platen is removed and the metal sheet etched away.

Inventors

• 👤 Gerald G Palmer

Bibliographic Details