US3615733A
Expired / Lapsed
US
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Electroless copper plating
Assignee: Shipley Co Inc
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Filing: 1968-08-13
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Granted: 1971-10-26
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Expires: 1988-08-13
Abstract
Abstract An electroless copper plating solution comprising a source of cupric ions, hydroxyl radicals, formaldehyde or a formaldehyde precursor, preferably paraformaldehyde, and a complexing agent for copper; said solution characterized by the addition of a combination of additives comprising an organic silicon compound and a hydrogen inclusion retarding agent and preferably, the combination of the two with at least one member selected from the group consisting of a formaldehyde addition agent and a Group VIII metal salt of the Periodic Chart of the Elements. Copper plate deposited from a solution of this invention is distinguishable from prior art copper deposits by substantially improved bending or tensile properties and a smoother, more highly reflecting appearance. The electroless copper plating solution is capable of providing a rapid rate of copper deposition dependent upon the selection of the complexing agent and the stability of its chelate with copper without sacrifice in tensile or bending properties of the copper deposit.
Inventors
- 👤 Charles R Shipley Jr
- 👤 Lucia H Shipley
- 👤 Michael Gulla
- 👤 Oleh B Dutkewych
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-28 10:54
CPC Classifications
C; C23; C23C; C23C18/00; C23C18/16; C23C18/31; C23C18/38; C23C18/40; C23C18/405
Claims Analysis
Total Claims: 18
Claim 1
Independent Claim
88 words
The copper plating solution of claim 1 containing as an additional additive at least one member selected from the group consisting of a formaldehyde addition agent in an amount of at least 0.1 moles per mole of formaldehyde in solution to that amount that prevents deposition of copper and a salt of a Group VIII metal of the Periodic Chart of the Elements in an amount of at least five parts per million parts of solution, said Group VIII metal salt having an anion noninterfering with said solution.
Claim 2
Dependent Claim
195 words
In an aqueous electroless copper plating solution comprising a source of cupric ions, hydroxyl radicals, formaldehyde and sufficient complexing agent to render said cupric ions soluble in alkaline solution, the improvement comprising an additive in the solution of an organic silicon compound, a solution-soluble alkali metal cyanide compound, and at least one of a formaldehyde addition agent selected from the group of alkali metal sulfites, bisulfites and phosphites and solution soluble salts of a Group VIII metal selected from the group of iron, nickel and platinum, said salts of a Group VIII metal having an anion noninterfering with said electroless copper solution, said organic silicon compound and said alkali metal cyanide being present in solution in combined amount insufficient to prevent copper deposition, each of said organic silicon compound and said alkali metal cyanide being present in solution in an amount of at least one part per million parts of solution, said formaldehyde addition agent being in an amount of about 0.1 moles per mole of formaldehyde to that amount that prevents copper deposition and said Group VIII metal salt being present in an amount of at least five parts per million parts of solution.
Claim 3
Dependent Claim
26 words
The copper plating solution of claim 3 having as additives the silicon compound, the cyanide compound, the formaldehyde addition agent and the Group VIII metal salt.
Claim 4
Dependent Claim
14 words
The copper solution of claim 4 where the silicon compound is a silicone fluid.
Claim 5
Dependent Claim
23 words
The copper solution of claim 5 where the Group VIII metal salt is selected from the group consisting of NiSO4, Fe2(SO4)3 and H2PtCl6.
Claim 6
Dependent Claim
22 words
The copper solution of claim 3 where the formaldehyde addition agent is selected from the group consisting of Na2SO3, NaHSO3 and Na2HPO3.5H2O.
Claim 7
Dependent Claim
13 words
The copper solution of claim 5 where the cyanide compound is sodium cyanide.
Claim 8
Dependent Claim
138 words
In an aqueous electroless copper plAting solution comprising a source of cupric ions, hydroxyl radicals, a source of formaldehyde and sufficient complexing agent to render said cupric ions soluble in alkaline solution, the improvement comprising an additive in the solution of a combination of an organic silicon compound and a hydrogen inclusion retarding agent selected from the group consisting of a water soluble cyanide compound, vanadium, molybdenum, niobium, tungsten, rhenium, arsenic, antimony, bismuth, rare earths of the actinum series, rare earths of the lanthanum series and mixtures of the foregoing, said organic silicon compound and said hydrogen inclusion retarding agent being present in a combined amount insufficient to prevent copper deposition and said organic silicon compound and said hydrogen inclusion retarding agent being present in solution in an amount of at least 1part per million parts of solution.
Claim 9
Dependent Claim
133 words
The copper plating solution of claim 9 containing as an additional additive at least one member selected from the group consisting of a formaldehyde addition agent in an amount of at least 0.1 moles per mole of formaldehyde in solution to that amount that prevents copper deposition and a salt of a Group VIII metal of the Periodic Chart of the Elements in an amount of at least five parts per million parts of solution, said formaldehyde addition agent being selected from the group consisting of metal salts of a member selected from the group consisting of sulfites, bisulfites and phosphites, and said salt of a Group VIII metal being selected from the group consisting of salts of platnium, iron and nickel and having an anion noninterfering with said electroless copper plating solution.
Claim 10
Dependent Claim
22 words
The copper solution of claim 10 having as additives, the silicon compound, the hydrogen inclusion retarding agent and the formaldehyde addition agent.
Claim 11
Dependent Claim
23 words
The copper solution of claim 10 having as additives, the silicon compound, the hydrogen inclusion retarding agent and the Group VIII metal salt.
Claim 12
Dependent Claim
27 words
The copper solution of claim 10 having as additives, the silicon compound, the hydrogen inclusion retarding agent, the formaldehyde addition agent and the Group VIII metal salt.
Claim 13
Dependent Claim
77 words
The copper solution of claim 13 having the following formulation: copper salt 0.02 to 0.12 moles formaldehyde 0.1 to 1 moles complexing agent 1 to 3 times the moles of cupric ion free hydroxide 0.1 to 0.8 moles hydrogen inclusion 5 to 250 p.p.m. retarding agent silicon compound 5 to 250 p.p.m. formaldehyde addition 0.1 to 1 times the moles of agent formaldehyde Group VIII metal salt 30 to 1,000 p.p.m. Water to 1 liter of solution
Claim 14
Dependent Claim
20 words
The copper solution of claim 10 where the organic-silicon compound is selected from the group consisting of silanes and polysiloxanes.
Claim 15
Dependent Claim
13 words
The copper solution of claim 15 where the silicon compound is a polysiloxane.
Claim 16
Dependent Claim
30 words
The copper solution of claim 10 where the silicon compound is added to the copper solution by dissolution in a solvent and addition of the solution to the copper solution.
Claim 17
Dependent Claim
17 words
The copper solution of claim 9 where the hydrogen inclusion retarding agent is an alkali metal cyanide.
Claim 18
Dependent Claim
15 words
The copper solution of claim 18 where the alkali metal cyanide compound is sodium cyanide.
References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1974-10-25 | 1975-04-26 | 1975-10-26 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1978-10-25 | 1979-04-26 | 1979-10-26 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1982-10-25 | 1983-04-26 | 1983-10-26 | $7700.00 | Window Closed / Lapsed |