US3614201A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Acoustically absorbent mounting method and apparatus for optical modulator
Assignee: AT&T Inc
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Filing: 1968-12-02
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Granted: 1971-10-19
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Expires: 1988-12-02
Abstract
Abstract Acoustical ringing which results from piezoelectric effects in an electrooptical modulator is suppressed by mounting the modulator crystal between massive, acoustically absorbent, support members which also provide an electric circuit interface for applying electric signals to the modulator. Solder provides such an absorbent mounting for a lithium tantalate electrooptical modulator crystal. Both solder support members are flowed into place during the same heating interval and permitted to cool simultaneously.
Inventors
- 👤 Martin R Biazzo
- 👤 Bernard G King
- 👤 William C G Ortel
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-25 17:30
CPC Classifications
G; G02; G02F; G02F1/00; G02F1/01; G02F1/03; G02F1/0305
Claims Analysis
Total Claims: 16
Claim 1
Independent Claim
97 words
In combination, an electro-optical modulator member of predetermined length dimension for operating on electromagnetic radiation transmitted along said length dimension through said member, a pair of electric contact means adjacent to opposite sides of said member along said length dimension, and means electrically connecting each of said contact means to a different one of said adjacent sides of said member for coupling an electric field through said member, said connecting means comprising acoustically absorbent material electrically and mechanically engaging substantially the full extent of said opposite sides for holding said member in position between said contact means.
Claim 2
Dependent Claim
97 words
In combination, an electro-optical modulator member of predetermined length dimension for operating on electromagnetic radiation transmitted along said length dimension through said member, a pair of electric contact means adjacent to opposite sides of said member along said length dimension, and means electrically connecting each of said contact means to a different one of said adjacent sides of said member for coupling an electric field through said member, said connecting means comprising acoustically absorbent material electrically and mechanically engaging substantially the full extent of said opposite sides for holding said member in position between said contact means.
Claim 3
Dependent Claim
22 words
The combination in accordance with claim 1 in which said connecting means are bonded to said faces and to said contact means.
Claim 4
Dependent Claim
35 words
The combination in accordance with claim 1 in which said contact means comprise a substrate with contact areas affixed thereto, and said connecting means support said member away from said substrate by a predetermined amount.
Claim 5
Dependent Claim
36 words
The combination in accordance with claim 1 wherein the interfaces between the connecting means and said member are substantially free of imperfections of sufficient magnitude to allow substantial vibration of said member at such an imperfection.
Claim 6
Dependent Claim
20 words
The combination in accordance with claim 1 in which said connecting means for each of said contact means is solder.
Claim 7
Dependent Claim
33 words
The combination in accordance with claim 1 in which said contact means comprise an acoustically live substrate with metallic contact areas thereon, and said connecting means comprise substantially entirely an acoustically dead material.
Claim 8
Dependent Claim
13 words
The combination in accordance with claIm 6 in which said material is solder.
Claim 9
Dependent Claim
26 words
The combination in accordance with claim 1 in which said connecting means have a total mass which is much greater than the mass of said member.
Claim 10
Dependent Claim
46 words
The combination in accordance with claim 8 in which said connecting means have a generally tapering cross-sectional configuration in a direction perpendicular to said length dimension, and said tapering configuration is largest adjacent to said member and tapers to its smallest part remote from said faces.
Claim 11
Dependent Claim
82 words
The combination in accordance with claim 1 in which said connecting means comprise a major mass of solder with a melting point of approximately 188* C. deposited on each of said contact means along said length dimension, and a connecting mass of solder having a melting point of approximately 95* C. deposited along said length dimension between said major mass of solder and each of said sides of said modulator and in electrical connection with substantially the full area of such sides.
Claim 12
Dependent Claim
46 words
The combination in accordance with claim 10 in which said major mass of solder comprises approximately 50 percent by weight of each of lead and tin, and said connecting mass of solder comprises by weight approximately 16 percent tin, 32 percent lead, and 52 percent bismuth.
Claim 13
Dependent Claim
41 words
The combination in accordance with claim 1 in which said contact means comprise a glass substrate, and metallic thin film contact areas deposited on said substrate spaced from one another by an amount to accommodate a width dimension of said member.
Claim 14
Dependent Claim
35 words
The combination in accordance with claim 12 in which said metallic thin film contact areas comprise laminated films of tantalum oxide, tantalum nitride, gold, copper, and solder affixed in the order named on said substrate.
Claim 15
Dependent Claim
55 words
The combination in accordance with claim 12 in which further contact areas are deposited on said sides of said member and comprise successive thin film laminations of chromium, copper, and gold, and said member is a crystalline material having a C-axis and said sides are those which are perpendicular to the eC-axis of said member.
Claim 16
Dependent Claim
73 words
The combination in accordance with claim 12 in which a semiconductor device is mounted on one of said contact areas in electrical contact therewith, said device being characterized by the generation and propagation of high-intensity electric field domains in response to the application of an electric field of predetermined threshold magnitude thereacross, and means including the contact means and the first-mentioned connecting means electrically connecting said semiconductor device in parallel with said member.
References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1974-10-18 | 1975-04-19 | 1975-10-19 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1978-10-18 | 1979-04-19 | 1979-10-19 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1982-10-18 | 1983-04-19 | 1983-10-19 | $7700.00 | Window Closed / Lapsed |