Molded capacitor and method

Claim 1

The capacitor of claim 1 in which the deformably arranged connecting wire is a U-shaped wire of smaller cross section than the anode lead wire and is arranged transversely of the anode riser wire and anode lead wire with a first welded connection near the end of one leg of the U-shaped wire to the anode riser wire, and a second welded connection near the end of the other leg of the U-shaped wire to the adjacent end of the anode lead wire.

Claim 6

The method of molding an insulative case around a tantalum solid electrolytic capacitor comprising: a. providing a porous tantalum anode body having a tantalum riser wire extending therefrom and a dielectric oxide film thereon, a solid electrolyte layer over the oxide and a conductive coating over the electrolyte layer with a cathode lead soldered to the conductive coating at one end of the body and a anode lead wire adjacent to but spaced away from the tantalum riser at the opposite end of the body and electrically connected thereto by an intervening deformably arranged connecting wire welded at one of its ends to the tantalum riser wire and at the other of its ends to the adjacent end of the anode lead wire, b. placing the body in the mold cavity formed by mating mold parts each having half cavities formed therein with lead wire grooves extending axially from each end of the cavities and closing the mold parts around the body to seal it in the cavity and to form the anode and cathode leads into the wire grooves, c. allowing the deformably arranged connecting wire to deform in response to relative movement of the anode and cathode lead wires caused by their being forced into the wire grooves whereby the tantalum riser wire and its oxide film is left unstressed in the mold cavity, d. admitting fluid moldinG material into the mold cavity and causing it to set around the body therein and unstressed tantalum riser wire and thereafter removing the molded capacitor from the mold.