Methods of manufacture of semiconductor elements and elements manufactured thereby
Abstract
Abstract A METHOD OF FORMING A SEMICONDUCTOR WAFER FROM A SLICE OF SEMICONDUCTOR MATERIAL. REGIONS OF ONE TYPE OF CONDUCTIVITY ARE FORMED ON A SEMICONDUCTOR SLICE OF THE OPPOSITE TYPE OF CONDUCTIVITY EXTENDING INWARDLY FROM EACH OF THE OPPOSED MAJOR FACES OF THE SLICE THEREBY TO FORM IN THE SLICE A PAIR OF P-N JUNCTIONS EXTENDING PARALLEL TO THE MAJOR FACES. RIGID METAL MEMBERS ARE THEN SECURED TO THE OPPOSED MAJOR FACES OF THE SLICE. MATERIAL IS THEN MECHANICALLY REMOVED FROM THE PERIPHERAL PORTION OF THE SLICE TO FORM A PERIPHERAL EDGE ON WHICH THE P-N JUNCTIONS EMIT AND MEET AT AN ACUTE ANGLE ON THAT SIDE OF THE P-N JUNCTION ON WHICH LIES THE ORIGINAL MATERIAL OF THE SLICE. THE PERIPHERAL EDGE MEETS THE MAJOR FACES ADJACENT THE RIGID METAL MEMBERS THUS PROVIDING A PROTECTION FOR THE CIRCUMFERENTIAL EDGES OF THE WAFER IN ITS FINALFORM.
Inventors
- 👤 John Mansell Garrett
Bibliographic Details
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