US3610871A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Initiation of a controlled fracture
Assignee: AT&T Inc
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Filing: 1970-02-19
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Granted: 1971-10-05
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Expires: 1990-02-19
Abstract
Abstract Ceramic substrates, and the like, are parted by reflecting a focused laser beam off a mirrored surface so that the focal point of the beam impinges upon the lower surface of the substrate at an extreme edge thereof. The impingement of the focused beam creates a precisely defined localized fracture in the substrate. Next, the substrate is displaced, relative to the laser beam, to intercept the beam before it is reflected from the mirrored surface. The laser beam is now intercepted by the upper surface of the substrate before the beam reaches its focal point, resulting in the beam energy being distributed over a larger area of the substrate. As the relative displacement of the laser beam with respect to the substrate continues, the localized fracture is controllably propagated along the substrate to part the substrate.
Inventors
- 👤 Robert Miller Lumley
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-28 16:12
CPC Classifications
C; C03; C03B; C03B33/00; C03B33/09; C03B33/091; C03B33/093; B; B23; B23K; B23K26/00; B23K26/36; B23K26/40; B23K26/50; B23K26/53; B28; B28D; B28D1/00; B28D1/22; B28D1/221; B23K2103/00; B23K2103/50; Y; Y10; Y10S; Y10S65/00; Y10S65/04
Claims Analysis
Total Claims: 13
Claim 1
Independent Claim
207 words
A method of parting a substrate, having at least first and second major surfaces, into at least two portions, comprising the steps of: projecting a focused beam of radiant energy along a first path; placing said substrate proximate said first path so that said first major surface faces the source of said beam, without intercepting said beam; deflecting said beam from said first path, through a controlled angle onto a second path, so that said beam impinges on the edge of said second major surface, said second major surface coinciding with the focal point of said now-deflected beam, thereby creating a localized fracture in said substrate which penetrates therethrough from said second major surface to said first major surface; displacing said substrate into said first path so that the region of said localized fracture on said first major surface intercepts said beam, said first major surface being spaced apart from said focal point by at least the thickness of said substrate; and further displacing said substrate, relative to said first path, so that the impingement of said beam on said first major surface traverses a predetermined partition path, thereby propagating said localized fracture along said partition path to part said substrate into said at least two portions.
Claim 2
Independent Claim
207 words
A method of parting a substrate, having at least first and second major surfaces, into at least two portions, comprising the steps of: projecting a focused beam of radiant energy along a first path; placing said substrate proximate said first path so that said first major surface faces the source of said beam, without intercepting said beam; deflecting said beam from said first path, through a controlled angle onto a second path, so that said beam impinges on the edge of said second major surface, said second major surface coinciding with the focal point of said now-deflected beam, thereby creating a localized fracture in said substrate which penetrates therethrough from said second major surface to said first major surface; displacing said substrate into said first path so that the region of said localized fracture on said first major surface intercepts said beam, said first major surface being spaced apart from said focal point by at least the thickness of said substrate; and further displacing said substrate, relative to said first path, so that the impingement of said beam on said first major surface traverses a predetermined partition path, thereby propagating said localized fracture along said partition path to part said substrate into said at least two portions.
Claim 3
Independent Claim
171 words
A method of parting a substrate, having at least first and second major surfaces, into at least two portions, comprising the steps of: momentarily applying a first focused beam of radiant energy to an extreme edge of said first major surface, said first major surface coInciding with the focal point of said first beam, to create a precisely located localized fracture in said substrate which penetrates therethrough from said first major surface to said second major surface; applying a second focused beam of radiant energy to said second major surface, said second major surface being spaced apart from the focal point of said second beam by a predetermined distance, so that said second beam impinges on said second major surface in the region of said localized fracture; displacing said substrate, relative to said second beam, so that the impingement of said second beam on said second major surface traverses a predetermined path, thereby propagating said localized fracture along said predetermined path to part said substrate into said at least two portions.
Claim 4
Independent Claim
171 words
A method of parting a substrate, having at least first and second major surfaces, into at least two portions, comprising the steps of: momentarily applying a first focused beam of radiant energy to an extreme edge of said first major surface, said first major surface coInciding with the focal point of said first beam, to create a precisely located localized fracture in said substrate which penetrates therethrough from said first major surface to said second major surface; applying a second focused beam of radiant energy to said second major surface, said second major surface being spaced apart from the focal point of said second beam by a predetermined distance, so that said second beam impinges on said second major surface in the region of said localized fracture; displacing said substrate, relative to said second beam, so that the impingement of said second beam on said second major surface traverses a predetermined path, thereby propagating said localized fracture along said predetermined path to part said substrate into said at least two portions.
Claim 5
Independent Claim
147 words
A method of parting a substrate into at least two portions, comprising the steps of: momentarily applying a first focused beam of radiant energy to an extreme edge of a surface of said substrate, said surface coinciding with the focal point of said first beam, to create a precisely located localized fracture which penetrates through said substrate; applying a second focused beam of radiant energy to the surface of said substrate, said surface being spaced apart from the focal point of said second beam by a predetermined distance, so that said second beam impinges on said surface in the region of said localized fracture; displacing said substrate, relative to said second beam, so that the impingement of said second beam on said surface traverses a predetermined partition path, thereby propagating said localized fracture along said partition path to part said substrate into said at least two portions.
Claim 6
Independent Claim
147 words
A method of parting a substrate into at least two portions, comprising the steps of: momentarily applying a first focused beam of radiant energy to an extreme edge of a surface of said substrate, said surface coinciding with the focal point of said first beam, to create a precisely located localized fracture which penetrates through said substrate; applying a second focused beam of radiant energy to the surface of said substrate, said surface being spaced apart from the focal point of said second beam by a predetermined distance, so that said second beam impinges on said surface in the region of said localized fracture; displacing said substrate, relative to said second beam, so that the impingement of said second beam on said surface traverses a predetermined partition path, thereby propagating said localized fracture along said partition path to part said substrate into said at least two portions.
Claim 7
Independent Claim
173 words
A method of parting a substrate, having at least first and second major surfaces, into at least two portions, comprising the steps of: projecting a focused beam of radiant energy along a first path onto a mirrored surface, thence along a second path to an extreme edge of said first major surface of said substrate, said first major surface coinciding with the focal point of said beam, thereby creating a localized fracture in said substrate which penetrates therethrough from said first major surface to said second major surface; displacing said substrate, relative to said beam, so that the substrate intercepts said first path, said beam impinging on said second major surface in the region of said localized fracture, said second major surface being spaced apart from said focal point by at least the thickness of said substrate; and further displacing said substrate, relative to said first beam, so that the impingement of said beam on said first major surface traverses a predetermined partition path, thereby propagating said localized fracture along said partition path.
Claim 8
Independent Claim
173 words
A method of parting a substrate, having at least first and second major surfaces, into at least two portions, comprising the steps of: projecting a focused beam of radiant energy along a first path onto a mirrored surface, thence along a second path to an extreme edge of said first major surface of said substrate, said first major surface coinciding with the focal point of said beam, thereby creating a localized fracture in said substrate which penetrates therethrough from said first major surface to said second major surface; displacing said substrate, relative to said beam, so that the substrate intercepts said first path, said beam impinging on said second major surface in the region of said localized fracture, said second major surface being spaced apart from said focal point by at least the thickness of said substrate; and further displacing said substrate, relative to said first beam, so that the impingement of said beam on said first major surface traverses a predetermined partition path, thereby propagating said localized fracture along said partition path.
Claim 9
Independent Claim
174 words
An apparatus for parting a substrate, having first and second major surfaces, along a predetermined partition path, which comprises: a source of a focused beam of radiant energy; means for deflecting said beam onto an extreme edge of the first major surface of said substrate, said first major surface coinciding with the focal point of said beam, thereby creating a localized fracture in said substrate which penetrates therethrough from said first major surface to said second major surface; means for displacing said substrate, relative to said beam, so that said substrate intercepts said beam between said source and said means for deflecting, said beam impinging upon the second major surface of said substrate in the region of said localized fracture, said second major surface being spaced apart from said focal point by at least the thickness of said substrate; and means for continuing said displacement so that the impingement of said beam on said second major surface traverses said partition path, thereby propagating said localized fracture along said partition path to part said substrate.
Claim 10
Independent Claim
174 words
An apparatus for parting a substrate, having first and second major surfaces, along a predetermined partition path, which comprises: a source of a focused beam of radiant energy; means for deflecting said beam onto an extreme edge of the first major surface of said substrate, said first major surface coinciding with the focal point of said beam, thereby creating a localized fracture in said substrate which penetrates therethrough from said first major surface to said second major surface; means for displacing said substrate, relative to said beam, so that said substrate intercepts said beam between said source and said means for deflecting, said beam impinging upon the second major surface of said substrate in the region of said localized fracture, said second major surface being spaced apart from said focal point by at least the thickness of said substrate; and means for continuing said displacement so that the impingement of said beam on said second major surface traverses said partition path, thereby propagating said localized fracture along said partition path to part said substrate.
Claim 11
Dependent Claim
21 words
The apparatus as defined in claim 5 in which said source of a focusEd beam of radiant energy is a laser.
Claim 12
Dependent Claim
18 words
The apparatus defined in claim 6 in which said means for deflecting said beam is a mirrored surface.
Claim 13
Dependent Claim
47 words
The apparatus defined in claim 7 in which said means for displacing said substrate and said means for continuing said displacement is a slidably mounted support member which supports said substrate and which is moved by an electric motor connected to said support member through rack-and-pinion gearing.
References Cited (Backward Citations)
US3112850A
Cited
DE1244346B
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1974-10-04 | 1975-04-05 | 1975-10-05 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1978-10-04 | 1979-04-05 | 1979-10-05 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1982-10-04 | 1983-04-05 | 1983-10-05 | $7700.00 | Window Closed / Lapsed |