US3607253A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Tin base solder alloy
Assignee: International Business Machines Corp
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Filing: 1969-12-24
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Granted: 1971-09-21
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Expires: 1989-12-24
Abstract
Abstract A tin base solder alloy containing 1-5 percent by weight bismuth. This invention pertains to solder alloys useful in electrical applications and in particular to a high creep strength tin base solder containing bismuth.
Inventors
- 👤 John F Cain
- 👤 Octavio I Chirino
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-02 07:12
CPC Classifications
B; B23; B23K; B23K35/00; B23K35/22; B23K35/24; B23K35/26; B23K35/262
Claims Analysis
Total Claims: 1
Claim 1
Independent Claim
31 words
A tin base solder alloy comprising: 2.0 percent by weight bismuth, 3.4 percent by weight silver, 1.0 percent by weight cadmium, 0.4 percent by weight antimony and the balance substantially tin.
References Cited (Backward Citations)
US2303193A
Cited
CH249426A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1974-09-20 | 1975-03-22 | 1975-09-21 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1978-09-20 | 1979-03-22 | 1979-09-21 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1982-09-20 | 1983-03-22 | 1983-09-21 | $7700.00 | Window Closed / Lapsed |