Method and apparatus for measuring adhesion of material bonds
Abstract
Abstract MEASURING ADHESION OF ONE MATERIAL TO ANOTHER AND TENSILE STRENGTH OF THE BOND BETWEEN THESE MATERIALS BY PRODUCING A PULSE OF TENSILE STRESS IN THE MATERIALS AND SUBJECTING THE BOND TO THE TENSILE STRESS SUCH AS BY IMPINGING A PULSE OF RADIANT ENERGY AGAINST A SURFACE OF ONE OF THE MATERIALS TO PRODUCE A COMPRESSIVE STRESS WAVE WITHIN THE MATERIAL, REFLECTING THE STRESS WAVE FROM A FREE SURFACE OF THE OTHER MATERIAL AND SUBJECTING THE BOND BETWEEN THE MATERIALS TO THE REFLECTED TENSILE WAVE. THE STRENGTH OF THE BOND MAY BE DETERMINED BY INCREMENTALLY INCREASING THE TENSILE STRESS WAVE AMPLITUDE TO EFFECT BOND FAILURE AND THE TENSILE STRENGTH DETERMINED BY MEASURING THIS AMPLITUDE.
Inventors
- 👤 Nordin C Anderholm
- 👤 Albert Goodman
Bibliographic Details
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