US3604836A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Dip-coated electrical components
Assignee: Sprague Electric Co
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Filing: 1969-09-08
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Granted: 1971-09-14
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Expires: 1989-09-08
Abstract
Abstract Solder globules applied to lead wires for dipped electrical components act as reference points and barriers in dipping, and as standoffs and soldering assists for circuit board mounting.
Inventors
- 👤 Ralph E Pierpont
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-24 09:32
CPC Classifications
H; H01; H01G; H01G2/00; H01G2/02; H01G2/06; H05; H05K; H05K3/00; H05K3/30; H05K3/32; H05K3/34; H05K3/3447; H05K2201/00; H05K2201/10; H05K2201/10613; H05K2201/10742; H05K2201/1075; H05K2201/10871; H05K2201/10954; H05K2201/10984
Claims Analysis
Total Claims: 4
Claim 1
Independent Claim
82 words
A dipped electrical component comprising at least one electrical element, at least one pair of leads attached to said element and extending from it in a planar relationship, each of said leads having a solder globule applied at a predetermineD location spaced from said element on said extending portions, a resin coating covering said element and said leads to said globules, said coating substantially filling the area between said element and said globules, said globules forming resin-dip barriers during the encapsulation process.
Claim 2
Dependent Claim
82 words
A dipped electrical component comprising at least one electrical element, at least one pair of leads attached to said element and extending from it in a planar relationship, each of said leads having a solder globule applied at a predetermineD location spaced from said element on said extending portions, a resin coating covering said element and said leads to said globules, said coating substantially filling the area between said element and said globules, said globules forming resin-dip barriers during the encapsulation process.
Claim 3
Dependent Claim
30 words
The electrical component of claim 1 wherein said locations are in close proximity to said electrical element such that interfacial tension causes a more complete resin fill in said area.
Claim 4
Dependent Claim
51 words
The electrical component of claim 1 wherein said leads are inserted in a circuit board, and the bottoms of said globules extend beyond said coating such that said globules act as component standoffs and solder assists in circuit board mounting operations, said leads being soldered to conductors on said circuit board.
References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1974-09-13 | 1975-03-15 | 1975-09-14 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1978-09-13 | 1979-03-15 | 1979-09-14 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1982-09-13 | 1983-03-15 | 1983-09-14 | $7700.00 | Window Closed / Lapsed |