Method and apparatus for automatically arranging,transporting,and measuring,and/or testing a plurality of semiconductor devices

Claim 2

Apparatus as defined in claim 2 wherein said vertically oblique member can accommodate only one semiconductor device at a time from its lower end onto said parallel tracks.

Claim 3

Apparatus as defined in claim 3 wherein slitted guide openings are provided at the lower end of said funnel-shaped, planar member; and said parallel tracks lining up the semiconductor devices extending through said guide openings.

Claim 4

Apparatus for arranging and testing semiconductor devices having three electrode leads, wherein the semiconductor devices are lined up, one behind the other, the improvement comprising in combination: a vertically oblique, funnel-shaped planar member whereon semiconductor devices are initially disposed, the narrower lower end of said member being able to accommodate one semiconductor device at a time; a pair of parallel tracks provided at said narrower, lower end of said member whereon said semiconductor devices are fed and lined up with the center electrode lead of said devices being disposed between said tracks, each of said tracks consisting of a flexible foil of insulator material; electrical contact means being provided on at least portions of said tracks for electrically connecting the electrode leads on said semiconductor devices to measuring instruments, said contact means defining measuring positions on said foils at predetermined locations therealong; said contact means being areas of said foils covered by a layer of material having good electrical conductance.

Claim 5

Apparatus, as defined in claim 5, wherein a first testing position is provided to determine the location of the electrode leads that extend between said tracks and further testing positions are provided for each possible electrode location to determine the characteristics of the semiconductor devices.

Claim 6

Apparatus as defined in claim 5 wherein said apparatus further comprises intermediate sheets to electrically shield the electrical contact means from one another; said contact means being connected to ground potential at the measuring position.

Claim 7

Apparatus for arranging and testing semiconductor devices having three electrode leads, wherein the semiconductor devices are lined up, one behind the other, the improvement comprising in combination a vertically oblique, funnel shaped planar member whereon semiconductor devices are initially disposed, the narrower lower end of said member being able to accommodate one semiconductor device at a time; a pair of parallel tracks provided at said narrower, lower end of said member whereon said semiconductor devices are fed and lined up with the center electrode lead of said devices being disposed between said tracks, said tracks being formed by foils of insulating material; electrical contact means being provided on at least portions of said tracks for electrically connecting the electrode leads of said semiconductor devices to testing instruments, said electrical contact means including, each of said foils being provided with metal layers on their respective surfaces away from each other; at least one of said foils being provided with a metal layer on a surface facing said other foil; said metal layers being electrically connected to testing instruments by way of conductive paths provided therefor.

Claim 8

Apparatus for arranging and testing semiconductor devices having three electrode leads, wherein the semiconductor devices are lined up, one behind the other, the improvement comprising in combination: a vertically oblique, funnel shaped planar member whereon semiconductor devices are initially disposed, the narrower lower end of said member being able to accommodate one semiconductor device at a time; a pair of parallel tracks provided at said narrower, lower end of said member whereon said semiconductor devices are few and lined up with the center electrode lead of said devices being disposed between said tracks, said tracks being formed by foils of insulating material; electrical contact means being provided on at least portions of said tracks for electrically connecting the electrode leads of said semiconductor devices to testing instruments, said electrical contact means defining measuring positions at predetermined locations along said tracks, said contact means further comprising metallic electrical connecting arms disposed parallel to the insulated tracks at the measuring positions provided thereon; pneumatic actuating means; said connecting arms being pressed towards said tracks and against the electrode leads of the lined up semiconductor devices by said pneumatic actuating means.

Claim 9

Apparatus as defined in claim 1 said apparatus further comprising a displaceable sorting device provided at the end of said tracks; said sorting device including separate compartments for different semiconductor devices according to characteristic evaluations made by the measuring instruments.

Claim 10

Apparatus as defined in claim 1 further comprising means for separating, in consecutive order, individual semiconductor devices, at each measuring position provided, from the other semiconductor devices lined up on said tracks.