US3594493A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Printed circuit assemblies and method
Assignee: Allard Way Holdings Ltd
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Filing: 1969-10-02
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Granted: 1971-07-20
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Expires: 1989-10-02
Abstract
Abstract A multilayer printed circuit assembly has connections between the layers formed by extending a printed circuit conductor from each layer through a number of aligned holes in the different layers to the outer surface of the assembly where the end faces of the conductors terminate in the same plane. A plated layer then interconnects the end faces. Component leads may also extend through holes to the connection plane. The assembly is potted in stages.
Inventors
- 👤 Alan Michael Kauffman
- 👤 James Bond
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-25 00:23
CPC Classifications
H; H05; H05K; H05K3/00; H05K3/22; H05K3/28; H05K3/284; H05K1/00; H05K1/02; H05K1/11; H05K1/111; H05K1/112; H05K1/113; H05K3/40; H05K3/4038; H05K3/4084; H05K2201/00; H05K2201/03; H05K2201/0332; H05K2201/0364; H05K2201/0379; H05K2201/0388; H05K2201/0397; H05K2201/09; H05K2201/09209; H05K2201/095; H05K2201/096; H05K2201/10; H05K2201/10613; H05K2201/10621; H05K2201/10689; H05K2201/10954; H05K2201/10977; H05K2203/00; H05K2203/02; H05K2203/025; H05K2203/06; H05K2203/063; H05K2203/13; H05K2203/1305; H05K2203/1316; H05K2203/14; H05K2203/1461; H05K2203/1469; H05K3/0011; H05K3/0017; H05K3/002; H05K3/10; H05K3/18; H05K3/181; H05K3/30; H05K3/32; H05K3/4007; H05K3/4092; H05K3/46; H05K3/4611; H05K3/4644
Claims Analysis
Total Claims: 5
Claim 1
Independent Claim
145 words
A printed circuit assembly comprising a plurality of superimposed printed circuits each including an insulating layer and a conductor layer, the printed circuits being arranged with the conductor layers and the insulating layers alternating, each said conductor layer having a numbEr of integral conductor portions, said conductor portions being bent transversely to said printed circuits and extending through holes in said insulating layers, said assembly further comprising an outer insulating layer with holes therein through which said conductor portions extend, said outer insulating layer having planar outer surface in which the ends of said conductor portions terminate, said holes in said outer insulating layer being filled with potting compound with said planar outer surface being continuous in the regions of termination of said conductor portions, and a pattern of conductive material formed on said planar outer surface to interconnect predetermined ones of said conductor portions.
Claim 2
Dependent Claim
145 words
A printed circuit assembly comprising a plurality of superimposed printed circuits each including an insulating layer and a conductor layer, the printed circuits being arranged with the conductor layers and the insulating layers alternating, each said conductor layer having a numbEr of integral conductor portions, said conductor portions being bent transversely to said printed circuits and extending through holes in said insulating layers, said assembly further comprising an outer insulating layer with holes therein through which said conductor portions extend, said outer insulating layer having planar outer surface in which the ends of said conductor portions terminate, said holes in said outer insulating layer being filled with potting compound with said planar outer surface being continuous in the regions of termination of said conductor portions, and a pattern of conductive material formed on said planar outer surface to interconnect predetermined ones of said conductor portions.
Claim 3
Dependent Claim
39 words
A printed circuit assembly according to claim 1 comprising at least one circuit component having a terminal conductor extending through holes in said insulating layers to said planar outer surface for interconnection with predetermined ones of said conductor portions.
Claim 4
Independent Claim
117 words
A method of forming interconnections between electrical conductor layers in a printed circuit assembly, comprising the steps of forming a number of holes in the insulating layers of a plurality of printed circuit boards, bending portions of the respective conductive layers overlying the holes to extend transversely to the printed circuit boards, superimposing said printed circuit boards with said holes in alignment and with the bent conductor portions extending through said holes, potting said conductor portions in said holes, removing those parts of the conductor portions and the potting compound extending beyond an outer planar surface of said assembly, and forming a pattern of conductive material on said planar surface interconnecting predetermined ones of said conductor portions.
Claim 5
Independent Claim
117 words
A method of forming interconnections between electrical conductor layers in a printed circuit assembly, comprising the steps of forming a number of holes in the insulating layers of a plurality of printed circuit boards, bending portions of the respective conductive layers overlying the holes to extend transversely to the printed circuit boards, superimposing said printed circuit boards with said holes in alignment and with the bent conductor portions extending through said holes, potting said conductor portions in said holes, removing those parts of the conductor portions and the potting compound extending beyond an outer planar surface of said assembly, and forming a pattern of conductive material on said planar surface interconnecting predetermined ones of said conductor portions.
References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1974-07-19 | 1975-01-18 | 1975-07-20 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1978-07-19 | 1979-01-18 | 1979-07-20 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1982-07-19 | 1983-01-18 | 1983-07-20 | $7700.00 | Window Closed / Lapsed |