US3590915A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Heat sink assembly for electronic components
Assignee: Individual
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Filing: 1969-04-15
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Granted: 1971-07-06
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Expires: 1989-04-15
Abstract
Abstract A heat sink modular assembly for electronic components is composed of a plurality of heat sink structures which all have substantially the same design, a prismatic overall shape with at least one geometrical plane of symmetry. Each individual heat sink of the assembly has a core with cooling vanes protruding therefrom and with means for attaching at least one semicondctor component, each core being traversed by one or more bores. The structures are aligned with, and adjacent to one another and are rigidly held together by at least one tensioning rod passing serially through the bores of the heat sink cores, thus forming a single rigid group in which the longitudinal axes of the respective heat sink structures extend transversely of the rod. At least two pairs of the cooling vanes extend from each core on opposite sides of the core axis in a plane parallel to the tensioning rod and are axially spaced from each other at opposite sides of the tensioning rod. The vanes of these pairs have abutment faces at their respective edges. All of these abutment faces on one side of the axis are situated in a plane perpendicular to the tensioning rod and parallel to the plane of symmetry, and all of the abutment faces on the opposite side of the rod are located in another plane parallel to the plane of symmetry. The entire heat sink structure inclusive of all other vanes is accommodated between the two abutment face planes.
Inventors
- 👤 Gunter Riedel
- 👤 Herbert Prenzlau
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-02 07:19
CPC Classifications
H; H10; H10W; H10W40/00; H10W40/60; H10W40/611; H10W90/00; H10W40/20; H10W40/231; H10W40/235; H10W40/237
Claims Analysis
Total Claims: 11
Claim 1
Independent Claim
295 words
A heat sink group assembly for electronic components, comprising a plurality of heat sink structures all having substantially the same design of substantially square prismatic shape with at least one geometrical plane of symmetry and each having a substantially plate-shaped core and cooling vanes protruding from the core, said core having means for attaching at least one semiconductor component to a surface thereof and having a bore, said heat sink structures being aligned with and adjacent to one another, fastening means having at least one insulated tensioning rod extending serially through said bores of said respective cores and joining said structures together to form the group with said prismatic structures having their respective longitudinal axes transverse to said rod, said bore of each core being located between two of said cooling vanes located in axially spaced relation to each other, said two vanes forming abutment faces at respective edges on opposite sides of the core axis, the abutment faces located at each of said sides being situated in an abutment face plane perpendicular to said tensioning rod and parallel to a plane of symmetry, and the entire heat sink structure inclusive of all of said vanes being located between said two abutment face planes, said heat sink structures extending transverse to the axis of said rod, said cooling vanes extending substantially parallel to the axis of said rod, and partitions axially spaced from each other along the rod and having bores traversed by said rod, said partitions being located on opposite sides of each of the heat sink structures and extending beyond at least one edge of each heat sink structure, said two vanes of each of said heat sink structures engaging at their edges each of the corresponding partitions of the heat sink structure.
Claim 2
Dependent Claim
295 words
A heat sink group assembly for electronic components, comprising a plurality of heat sink structures all having substantially the same design of substantially square prismatic shape with at least one geometrical plane of symmetry and each having a substantially plate-shaped core and cooling vanes protruding from the core, said core having means for attaching at least one semiconductor component to a surface thereof and having a bore, said heat sink structures being aligned with and adjacent to one another, fastening means having at least one insulated tensioning rod extending serially through said bores of said respective cores and joining said structures together to form the group with said prismatic structures having their respective longitudinal axes transverse to said rod, said bore of each core being located between two of said cooling vanes located in axially spaced relation to each other, said two vanes forming abutment faces at respective edges on opposite sides of the core axis, the abutment faces located at each of said sides being situated in an abutment face plane perpendicular to said tensioning rod and parallel to a plane of symmetry, and the entire heat sink structure inclusive of all of said vanes being located between said two abutment face planes, said heat sink structures extending transverse to the axis of said rod, said cooling vanes extending substantially parallel to the axis of said rod, and partitions axially spaced from each other along the rod and having bores traversed by said rod, said partitions being located on opposite sides of each of the heat sink structures and extending beyond at least one edge of each heat sink structure, said two vanes of each of said heat sink structures engaging at their edges each of the corresponding partitions of the heat sink structure.
Claim 3
Dependent Claim
108 words
An assembly according to claim 1, wherein at least two pairs of said cooling vanes are provided with said abutment faces, said two vane pairs extending from said core in each structure on opposite sides of said axis in a plane parallel to said tensioning rod and being axially spaced from each other at opposite sides of said bore and tensioning rod, said partitions extend beyond said two vanes of each of said heat sink structures which engage said partitions, and further comprising two pressure plates seated on the tensioning rod on opposite sides of the group of heat sink structures for clamping said structures to each other.
Claim 4
Dependent Claim
53 words
An assembly according to claim 1, further comprising two pressure plates seated on the tensioning rod on opposite sides of the group of heat sink structures for clamping said structures to one another and wherein each of said pressure plates extends across the respective abutment faces of one of said abutment face planes.
Claim 5
Dependent Claim
230 words
An assembly according to claim 1, wherein at least two pairs of said cooling vanes are provided with said abutment faces, said two vane pairs extending from said core in each strUcture on opposite sides of said axis in a plane parallel to said tensioning rod and being axially spaced from each other at opposite sides of said bore and tensioning rod, said core of said heat sink structure having a rectangular cross section and being elongated in symmetry to a first one of said symmetry planes, said core having a second symmetry plane at a right angle to said first symmetry plane, said attaching means being situated on at least one of the end faces of said core, said vanes protruding from the two broad sides of said core at a right angle to said first symmetry plane, said abutment faces extending parallel to said first plane of symmetry at respective equal distances therefrom, all others of said cooling vanes being situated within the space between said core and said abutment face planes, said bore extending perpendicular to said first symmetry plane, and said fastening means comprising two pressure plates resting against the two outermost ones of said heat sink structures of said group, each of said pressure plates being seated on said tensioning rod and extending across the respective abutment faces in one of said abutment face planes.
Claim 6
Dependent Claim
21 words
An assembly according to claim 4, wherein said cooling vanes extend perpendicularly to both said first and second planes of symmetry.
Claim 7
Dependent Claim
118 words
An assembly according to claim 1, wherein each of said heat sink structures has a second symmetry plane perpendicular to said one symmetry plane, each of said partitions protruding beyond said prismatic heat sink structure and having edges parallel to said heat sink edges and spaced from said second plane of symmetry a larger distance than said heat sink edges, and further comprising auxiliary plates affixed to said two vanes of each of said heat sink structures at both ends of each of said cores and extending transversely to the axis of the rod, said auxiliary plates forming together with said partitions a channel of substantially rectangular cross section around at least one of said heat sink structures.
Claim 8
Dependent Claim
45 words
An assembly according to claim 6, wherein said auxiliary plates and said partitions comprise insulating material and said auxiliary plates have opposite marginal portions extending beyond the edges of said vanes, said auxiliary plates having abutment faces located in one of said abutment face planes.
Claim 9
Dependent Claim
23 words
An assembly according to claim 6, further comprising circuit components fastened to the protruding portion of the partitions and to the auxiliary plates.
Claim 10
Dependent Claim
28 words
An assembly according to claim 8, wherein said circuit components are mounted in the spaces between the protruding portions of said partitions which extend beyond the cooling vanes.
Claim 11
Dependent Claim
103 words
An assembly according to claim 4, wherein said core has pyramidal shape so as to have at one axial end a larger rectangular cross section than at the other end, said vanes being integral with said core and having all the same rectangular outer contour, said bore and said two vane pairs being situated generally near the middle of the core length, the other vanes being axially spaced from each other between said vane pairs and the two axial ends respectively of said core, said means for attaching at least one semiconductor device being situated at said one end of larger cross section.
References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1974-07-05 | 1975-01-04 | 1975-07-06 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1978-07-05 | 1979-01-04 | 1979-07-06 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1982-07-05 | 1983-01-04 | 1983-07-06 | $7700.00 | Window Closed / Lapsed |