US3590328A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Module assembly and method of making same
Assignee: HP Inc
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Filing: 1969-10-29
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Granted: 1971-06-29
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Expires: 1989-10-29
Abstract
Abstract A module assembly includes a sheetlike aluminum substrate, a plurality of semiconductor light emitting elements bonded to one edge of the substrate, and an integrated circuit and metal plane conductor pattern bonded to the lateral surface of the substrate. The conductor pattern and substrate are bonded together by a Teflon FEP coated polyimide film disposed between them. The conductor pattern electrically interconnects the light emitting elements and the integrated circuit and provides input terminals connectable to an external signal source. Selected areas of the module are encapsulated with a very thin layer of silicone compound which is secured to the substrate. The module components are fabricated by bonding and encapsulating steps which permit formation of a thin, mechanically sturdy and integral unit without causing thermal stress in the semiconductor components thereof.
Inventors
- 👤 Bert L Frescura
- 👤 Nicholas G Spilling
- 👤 Harry P Vossen
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-24 01:47
CPC Classifications
H; H10; H10W; H10W90/00
Claims Analysis
Total Claims: 12
Claim 1
Independent Claim
227 words
A miniaturized module assembly comprising: a thermally and electrically conductive plate member having lateral and edge surfaces; an insulating film overlaying and bonded to a lateral surface of said plate member, said film being apertured to expose a portion of the lateral surface; an integrated circuit chip bonded to said exposed portion of the lateral surface of said plate member in electrical and thermal contact therewith; a display assembly including: an electrically conductive elongated mounting strip; a plurality of indicating elements attached in spaced-apart relation in a linear array on Said mounting strip; said mounting strip and attached indicating elements being bonded onto an edge of said plate member; a metal plane conductor pattern overlaying and bonded to said insulating film, said conductor pattern having a first array of contact points disposed along said edge of said plate member and connected to said plurality of indicating elements, a second array of contact points disposed about the periphery of said exposed portion of the lateral surface and connected to said integrated circuit chip, and a third array of contact points forming end terminals projecting from another edge of said plate member for coupling electrical input signals to said indicating elements and said integrated circuit chip; and a plastic insulating material providing a thin encapsulating layer over selected areas of said plate member and said metal plane conductor pattern.
Claim 2
Dependent Claim
227 words
A miniaturized module assembly comprising: a thermally and electrically conductive plate member having lateral and edge surfaces; an insulating film overlaying and bonded to a lateral surface of said plate member, said film being apertured to expose a portion of the lateral surface; an integrated circuit chip bonded to said exposed portion of the lateral surface of said plate member in electrical and thermal contact therewith; a display assembly including: an electrically conductive elongated mounting strip; a plurality of indicating elements attached in spaced-apart relation in a linear array on Said mounting strip; said mounting strip and attached indicating elements being bonded onto an edge of said plate member; a metal plane conductor pattern overlaying and bonded to said insulating film, said conductor pattern having a first array of contact points disposed along said edge of said plate member and connected to said plurality of indicating elements, a second array of contact points disposed about the periphery of said exposed portion of the lateral surface and connected to said integrated circuit chip, and a third array of contact points forming end terminals projecting from another edge of said plate member for coupling electrical input signals to said indicating elements and said integrated circuit chip; and a plastic insulating material providing a thin encapsulating layer over selected areas of said plate member and said metal plane conductor pattern.
Claim 3
Dependent Claim
52 words
The module assembly of claim 1: said plate member having a plurality of apertures therethrough communicating between said lateral surfaces; said insulating film having apertures coinciding with said plurality of apertures in said plate member; and said plastic encapsulating material being formed into said apertures to securely hold said thin encapsulating layer.
Claim 4
Dependent Claim
16 words
The module assembly of claim 2, wherein said plate member is formed from an aluminum sheet.
Claim 5
Dependent Claim
30 words
The module assembly of claim 2, said encapsulating material being formed to expose said first, second and third arrays of contact points, said indicating elements, and said integrated circuit chip.
Claim 6
Dependent Claim
40 words
The module assembly of claim 4, further including: a cover plate overlaying said integrated circuit chip; and an elongated translucent cap covering said linear array of indicating elements and said first array of contact points connectable to said indicating elements.
Claim 7
Dependent Claim
23 words
The module assembly of claim 1, wherein said insulating film is formed of a polyimide material coated on both sides with fluorinated ethylenepropylene.
Claim 8
Dependent Claim
203 words
In a method of making a module assembly the steps comprising: forming a first sheet of metal into a substrate; forming a second sheet of metal into a conductor pattern; shaping an insulating film of polyimide material coated on both sides with a temperature sensitive bonding material to overlay a lateral surface of said substrate and to expose a portion of said lateral surface through at least one aperture in said film; bonding said conductor pattern to said lateral surface of said substrate by placing therebetween said film of coated polyimide material, pressing said substrate and said conductor pattern together with a predetermined pressure, and applying heat at a predetermined temperature to soften said bonding material coatings; encapsulating selected portions of the bonded substrate and conductor pattern by molding a layer of silicone compound thereon; attaching a plurality of indicating elements in a linear array onto a metal mounting strip, and bonding said mounting strip onto said exposed edge of said sheet metal substrate; and attaching an integrated circuit chip to a metal mounting pad and bonding said mounting pad to the exposed lateral surface portion of said substrate; whereby thermal stress on the module components is minimized during fabrication of the module.
Claim 9
Dependent Claim
203 words
In a method of making a module assembly the steps comprising: forming a first sheet of metal into a substrate; forming a second sheet of metal into a conductor pattern; shaping an insulating film of polyimide material coated on both sides with a temperature sensitive bonding material to overlay a lateral surface of said substrate and to expose a portion of said lateral surface through at least one aperture in said film; bonding said conductor pattern to said lateral surface of said substrate by placing therebetween said film of coated polyimide material, pressing said substrate and said conductor pattern together with a predetermined pressure, and applying heat at a predetermined temperature to soften said bonding material coatings; encapsulating selected portions of the bonded substrate and conductor pattern by molding a layer of silicone compound thereon; attaching a plurality of indicating elements in a linear array onto a metal mounting strip, and bonding said mounting strip onto said exposed edge of said sheet metal substrate; and attaching an integrated circuit chip to a metal mounting pad and bonding said mounting pad to the exposed lateral surface portion of said substrate; whereby thermal stress on the module components is minimized during fabrication of the module.
Claim 10
Dependent Claim
22 words
The method of claim 7, wherein said temperature sensitive bonding material coating on both sides of said polyimide material is fluorinated ethylenepropylene.
Claim 11
Dependent Claim
50 words
The method of claim 7, wherein the first bonding step includes pressing said substrate and said conductor pattern together with a pressure of 275 to 350 pounds per square inch and applying heat at a temperature of 290* to 320* C. for a time period not less than 5 minutes.
Claim 12
Dependent Claim
65 words
The method of claim 7, wherein after the steps of forming a substrate and shaping an insulating film there is further included the step of making a plurality of holes through said sUbstrate and said overlaying insulating film, and wherein the step of encapsulating includes molding said silicone compound into said holes to securely hold the encapsulating layer on said substrate and said conductor pattern.
References Cited (Backward Citations)
US3240990A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1974-06-28 | 1974-12-28 | 1975-06-29 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1978-06-28 | 1978-12-28 | 1979-06-29 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1982-06-28 | 1982-12-28 | 1983-06-29 | $7700.00 | Window Closed / Lapsed |