US3584264A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Encapsulated microcircuit device
Assignee: Westinghouse Electric Corp
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Filing: 1968-03-21
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Granted: 1971-06-08
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Expires: 1988-03-21
Abstract
Abstract An encapsulated microcircuit device including a wafer of semiconductor material, an intermediate coating of silicon dioxide on the wafer, a metal interconnect pattern on the silicon dioxide coating and having portions extending therethrough to the wafer, an outer coating on the intermediate coating and on the metal interconnect pattern and being composed of glass and a metal oxide and having a coefficient of thermal expansion substantially equal to that of the interconnect pattern and the silicon dioxide coating.
Inventors
- 👤 Raymond M Mclouski
- 👤 James R Cricchi
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-24 08:38
CPC Classifications
H; H10; H10W; H10W74/00; H10W74/40; H10W74/43; H10P; H10P14/00; H10P14/60; H10P14/63; H10P14/6326; H10P14/6328; H10P14/6334; H10P14/69; H10P14/692; H10P14/6921; H10P14/6922; H10P14/6923; H10W74/10; H10W74/131; Y; Y10; Y10S; Y10S148/00; Y10S148/043; Y10S148/118
Claims Analysis
Total Claims: 0
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References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1974-06-07 | 1974-12-07 | 1975-06-08 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1978-06-07 | 1978-12-07 | 1979-06-08 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1982-06-07 | 1982-12-07 | 1983-06-08 | $7700.00 | Window Closed / Lapsed |