US3579813A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Method of making electronic components on comblike metal fingers and severing the fingers
Assignee: Matsuo Electric Co Ltd
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Filing: 1969-12-11
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Granted: 1971-05-25
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Expires: 1989-12-11
Abstract
Abstract A method of making a chip-shaped electronic component by etching a metal plate to form a plurality of raised terminals, forming a comblike metal plate having electronic elements formed on the outer ends of the projections and then electrically and mechanically securing the electronic elements to the terminals and then separating the individual chip-shaped components to form a resultant structure having downwardly extending terminals which may be readily soldered or otherwise attached to a printed circuit board or other electronic circuit structure.
Inventors
- 👤 Hiroshi Tomiwa
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-01 07:59
CPC Classifications
H; H01; H01G; H01G9/00; H01G9/004; H01G9/008; H01G9/012; Y; Y10; Y10T; Y10T29/00; Y10T29/43
Claims Analysis
Total Claims: 4
Claim 1
Independent Claim
179 words
The method of manufacturing resin-molded chip-shaped electronic components comprising the steps of etching one surface of a metal plate through part of its thickness to form an array of a plurality of sets of discrete terminals interconnected by part of the thickness of said plate, forming a comblike metal structure having a plurality of spaced parallel projections extending therefrom, forming an electronic component on each of said spaced parallel projections, positioning said comblike structure on said etched metal plate with said electronic components in alignment with at least one terminal of each set and an adjoining portion of said projection in alignment with another terminal of each set, electrically connecting said electronic components and said adjoining portions of said projections to said terminals severing said projections adjoining said other set of terminals, molding a resin about said terminals and electronic components and then severing the portions of said plate interconnecting said terminals and then severing the resin to separate said sets of terminals to form a plurality of said components with the terminals being disposed on one face thereof.
Claim 2
Independent Claim
179 words
The method of manufacturing resin-molded chip-shaped electronic components comprising the steps of etching one surface of a metal plate through part of its thickness to form an array of a plurality of sets of discrete terminals interconnected by part of the thickness of said plate, forming a comblike metal structure having a plurality of spaced parallel projections extending therefrom, forming an electronic component on each of said spaced parallel projections, positioning said comblike structure on said etched metal plate with said electronic components in alignment with at least one terminal of each set and an adjoining portion of said projection in alignment with another terminal of each set, electrically connecting said electronic components and said adjoining portions of said projections to said terminals severing said projections adjoining said other set of terminals, molding a resin about said terminals and electronic components and then severing the portions of said plate interconnecting said terminals and then severing the resin to separate said sets of terminals to form a plurality of said components with the terminals being disposed on one face thereof.
Claim 3
Dependent Claim
33 words
The method of manufacturing resin-molded chip-shaped electronic components according to claim 1 wherein said interconnecting portions of said plate are severed by etching the metal and said terminals project from said one face.
Claim 4
Dependent Claim
43 words
The method of manufacturing resin-molded chip-shaped electronic components according to claim 2 wherein the last said etching step removes selected parts of said interconnecting portions whereby said terminals include integral portions extending outwardly therefrom and parallel to the plane of said one face.
References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1974-05-24 | 1974-11-23 | 1975-05-25 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1978-05-24 | 1978-11-23 | 1979-05-25 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1982-05-24 | 1982-11-23 | 1983-05-25 | $7700.00 | Window Closed / Lapsed |