Abstract A method of making a chip-shaped electronic component by forming a laminated structure consisting of a metal plate and a substrate adhesively secured to one side thereof. Etching the metal plate to form a plurality of raised terminals and then forming a plurality of elongated conductive members having electronic elements formed on the outer ends thereof, which elements are then electrically and mechanically secured to selected terminals while adjoining portions of said conductive members are secured to other terminals of each set. Enclosing the formed structure within a molded resin and then stripping the substrate to expose one surface of the sets of terminals. Thereafter the structure is cut to separate the components one from the others. An improved electronic component is provided having the terminals on one face thereof which thereby facilitates attachment to a printed circuit board or other electronic circuit structure.
The method of manufacturing resin molded chip-shaped electronic components comprising the steps of adhering a supporting substrate to one side of a metal plate, selectively etching the other side of said metal plate to form a plurality of sets of terminals, forming a plurality of elongated conductive members in fixed spaced parallel relationship and coordinated with said sets of terminals, electrically connecting electronic elements to said elongated conductive members, electrically connecting said elements and portions of said members to corresponding sets of terminals, severing said elongated members at points adjoining said sets of terminals, molding a resin about said electronic elements, the remaining portions of said members and said sets of terminals, stripping said substrate from said molded resin and terminals to expose said terminals and then severing said resin to separate said sets of terminals one from the other.
Claim 2
Independent Claim
140 words
The method of manufacturing resin molded chip-shaped electronic components comprising the steps of adhering a supporting substrate to one side of a metal plate, selectively etching the other side of said metal plate to form a plurality of sets of terminals, forming a plurality of elongated conductive members in fixed spaced parallel relationship and coordinated with said sets of terminals, electrically connecting electronic elements to said elongated conductive members, electrically connecting said elements and portions of said members to corresponding sets of terminals, severing said elongated members at points adjoining said sets of terminals, molding a resin about said electronic elements, the remaining portions of said members and said sets of terminals, stripping said substrate from said molded resin and terminals to expose said terminals and then severing said resin to separate said sets of terminals one from the other.
Claim 3
Dependent Claim
25 words
A method of manufacturing resin-molded chip-shaped electronic components according to claim 1 wherein said substrate is affixed to said metal plate by double-sided adhesive tape.
Claim 4
Dependent Claim
26 words
A method of manufacturing resin-molded chip-shaped electronic components according to claim 1 wherein said substrate is adhered to said metal plate by a layer of adhesive.