Controlled rectifier mounting assembly

Claim 2

A power supply circuit assembly comprising, a plurality of first mounting plates formed of thermally and electrically conductive material, a plurality of second mounting plates each formed of insulating material having a plurality of conductive portions, said first and second mounting plates being axially spaced and alternately disposed, a plurality of groups of pressure contact type of semiconductors, each of said groups of semiconductors being disposed between respective first and second mounting plates with opposite ends of a semiconductor engaging respectively said first mounting plate and a conductive portion of a second mounting plate, and clamping means for applying axial pressure to said unit to thereby apply axial force to said semiconductors through said mounting plate of sufficient magnitude to provide proper operation of said semiconductors, said first mounting plates and said conductive portions of said second mounting plates forming power output and input terminals for said circuit assembly.

Claim 3

A mounting assembly for a polyphase frequency converter power supply circuit including three axially aligned stacks of pressure contact semiconductors having oppositely disposed end electrodes in which the semiconductor stacks are formed by groups of three commonly poled semiconductors which are spaced laterally and symmetrically apart, said mounting assembly comprising: a plurality of first mounting means including thermally and electrically conductive members having a first electrical terminal means and opposite side surfaces, each side surface respectively engaging one end of said groups of semiconductors; a plurality of second mounting means, each of said second mounting means including three electrically insulated conductive portions formed of a thermally and electrically conductive material, each of said conductive portions having a second electrical terminal means and opposite side surfaces respectively engaging the ends of a pair of adjacent semiconductors included in one of said stacks of semiconductors, said first and second mounting means being alternately disposed for respectively engaging the opposite ends of said groups of semiconductors; means for applying pressure to the opposite ends of said mounting assembly so that predetermined contact pressure is applied to the end electrodes of said semiconductors, whereby the end electrodes of a first plurality of axially adjacent groups of semiconductors are connected to a common electrical junction by said first mounting means and the three pairs of end electrodes of a second plurality of axially adjacent groups of semiconductors are respectively connected together by said insulated conductive portions of said second mounting means; said second terminal means of each conductive portion associated with one of the semiconductor stacks providing power input terminals for said mounting assembly adapted to be connected with an electrical power source; said first mounting means providing power output terminals which are adapted to be connected to an electrical load.

Claim 4

A mounting assembly for a polyphase frequency converter power supply circuit including three axially aligned stacks of pressure contact semiconductors having oppositely disposed end electrodes in which the semiconductor stacks are formed by groups of three commonly poled semiconductors which are spaced laterally and symmetrically apart, said mounting assembly comprising: a plurality of first mounting means including thermally and electrically conductive members having a first electrical terminal means and opposite side surfaces, each side surface respectively engaging one end of said groups of semiconductors; a plurality of second mounting means, each of said second mounting means including three electrically insulated conductive portions formed of a thermally and electrically conductive material, each of said conductive portions having a second electrical terminal means and opposite side surfaces respectively engaging the ends of a pair of adjacent semiconductors included in one of said stacks of semiconductors, said first and second mounting means being alternately disposed for respectively engaging the opposite ends of said groups of semiconductors; means for applying pressure to the opposite ends of said mounting assembly so that predetermined contact pressure is applied to the end electrodes of said semiconductors, whereby the end electrodes of a first plurality of axially adjacent groups of semiconductors are connected to a common electrical junction by said first mounting means and the three pairs of end electrodes of a second plurality of axially adjacent groups of semiconductors are respectively connected together by said insulated conductive portions of said second mounting means; said second terminal means of each conductive portion associated with one of the semiconductor stacks providing power input terminals for said mounting assembly adapted to be connected with an electrical power source; said first mounting means providing power output terminals which are adapted to be connected to an electrical load.

Claim 5

A mounting assembly for a power supply circuit including a Plurality of stacks of pressure contact semiconductors having flat end electrodes, said mounting assembly comprising: a plurality of first mounting plates formed of an electrically and thermally conductive material; a plurality of second mounting plates including an insulating plate and a plurality of spaced apart conductive inserts formed of a thermally and electrically conductive material, said first and said second mounting plates including internal passages for conducting a cooling liquid, said passages extending within each of said mounting plates and terminating at a pair of passage openings formed in each of said first and said second mounting plates; means for supporting each of said semiconductors between one of said first mounting plates and a conductive insert of one of said second mounting plates; conduit means connnected between passage openings of mutually adjacent mounting plates; and a pressure applying means for clamping said first and said second mounting plates together when said plurality of stacks of semiconductors are supported therebetween so that operative contact pressure is provided for each of said semiconductor end electrodes; said mounting plate passages and said conduit means forming in a continuous conduit path for conducting a cooling liquid through said mounting assembly.

Claim 6

A mounting assembly for a power supply circuit including a Plurality of stacks of pressure contact semiconductors having flat end electrodes, said mounting assembly comprising: a plurality of first mounting plates formed of an electrically and thermally conductive material; a plurality of second mounting plates including an insulating plate and a plurality of spaced apart conductive inserts formed of a thermally and electrically conductive material, said first and said second mounting plates including internal passages for conducting a cooling liquid, said passages extending within each of said mounting plates and terminating at a pair of passage openings formed in each of said first and said second mounting plates; means for supporting each of said semiconductors between one of said first mounting plates and a conductive insert of one of said second mounting plates; conduit means connnected between passage openings of mutually adjacent mounting plates; and a pressure applying means for clamping said first and said second mounting plates together when said plurality of stacks of semiconductors are supported therebetween so that operative contact pressure is provided for each of said semiconductor end electrodes; said mounting plate passages and said conduit means forming in a continuous conduit path for conducting a cooling liquid through said mounting assembly.

Claim 7

A mounting assembly for a power supply circuit including a plurality of stacks of pressure contact semiconductors having flat end electrodes, said mounting assembly comprising: a plurality of first mounting plates formed of an electrically and thermally conductive material; a plurality of second mounting plates including an insulating plate carrying a plurality of spaced apart conductive inserts formed of a thermally and electrically conductive material, said first and said second mounting plates having internal passages for conducting a cooling liquid, said passages extending within each of said mounting plates and terminating at axially disposed passage openings formed in the sides of each of said first and said second mounting plates; means for supporting each of said semiconductors between one of said first mounting plates and a conductive insert of one of said second mounting plates with the passage openings of adjacent mounting plates being oppositely disposed in axial alignment; a plurality of tubular couplings slidably mounted within the oppositely disposed passage openings of said adjacent mounting plates; and a pressure-applying means for clamping said first and said second mounting plates together when said plurality of stacks of semiconductors are supported therebetween so that operative contact pressure is provided for each of said semiconductor end electrodes; said mounting plate passages and said tubular couplings forming a path for conducting a cooling liquid through said mounting assembly.

Claim 8

A mounting assembly for a power supply circuit including a plurality of stacks of pressure contact semiconductors having flat end electrodes, said mounting assembly comprising: a plurality of first mounting plates formed of an electrically and thermally conductive material; a plurality of second mounting plates including an insulating plate carrying a plurality of spaced apart conductive inserts formed of a thermally and electrically conductive material, said first and said second mounting plates having internal passages for conducting a cooling liquid, said passages extending within each of said mounting plates and terminating at axially disposed passage openings formed in the sides of each of said first and said second mounting plates; means for supporting each of said semiconductors between one of said first mounting plates and a conductive insert of one of said second mounting plates with the passage openings of adjacent mounting plates being oppositely disposed in axial alignment; a plurality of tubular couplings slidably mounted within the oppositely disposed passage openings of said adjacent mounting plates; and a pressure-applying means for clamping said first and said second mounting plates together when said plurality of stacks of semiconductors are supported therebetween so that operative contact pressure is provided for each of said semiconductor end electrodes; said mounting plate passages and said tubular couplings forming a path for conducting a cooling liquid through said mounting assembly.

Claim 9

A mounting assembly for a power supply circuit including a plurality of stacks of pressure contact semiconductors having flat end electrodes wherein said plurality of stacks of semiconductors are formed by groups of laterally arranged semiconductors, said mounting assembly comprising: a plurality of first mounting plates formed of a solid electrically and thermally conductive material, said first mounting plates having opposite side surfaces including areas engaging two axially adjacent groups of semiconductors; a plurality of second mounting plates; said second mounting plates including an insulating plate portion and a plurality of spaced-apart conductive inserts formed of a thermally and electrically conductive material, said conductive inserts including side portions having areas engaging a pair of adjacent semiconductors included in two adjacent groups of semiconductors, said first and said second mounting plates including internal passages for conducting a cooling liquid, said passages extending within each of said mounting plates and between said areas engaging adjacently disposed semiconductors, said passages terminating at axially disposed passage openings Formed in the sides of each of said first and said second mounting plates, means for supporting opposite ends of each of said semiconductors between said semiconductor support areas of said first and second mounting plates with the passage openings of adjacent mounting plates being oppositely disposed in axial alignment; a plurality of tubular couplings including annular sealing members at each end thereof, said tubular coupling ends slidably and sealingly mounted within said passage openings of said adjacent mounting plates; a pressure applying means for clamping said first and said second mounting plates together when said plurality of stacks of semiconductors are supported therebetween so that operative contact pressure is provided for each of said semiconductor end electrodes; and means for connecting the mounting plate passages and said tubular couplings in a continuous conduit path for conducting a cooling liquid through said mounting assembly.

Claim 10

A mounting assembly for a power supply circuit including a plurality of stacks of pressure contact semiconductors having flat end electrodes wherein said plurality of stacks of semiconductors are formed by groups of laterally arranged semiconductors, said mounting assembly comprising: a plurality of first mounting plates formed of a solid electrically and thermally conductive material, said first mounting plates having opposite side surfaces including areas engaging two axially adjacent groups of semiconductors; a plurality of second mounting plates; said second mounting plates including an insulating plate portion and a plurality of spaced-apart conductive inserts formed of a thermally and electrically conductive material, said conductive inserts including side portions having areas engaging a pair of adjacent semiconductors included in two adjacent groups of semiconductors, said first and said second mounting plates including internal passages for conducting a cooling liquid, said passages extending within each of said mounting plates and between said areas engaging adjacently disposed semiconductors, said passages terminating at axially disposed passage openings Formed in the sides of each of said first and said second mounting plates, means for supporting opposite ends of each of said semiconductors between said semiconductor support areas of said first and second mounting plates with the passage openings of adjacent mounting plates being oppositely disposed in axial alignment; a plurality of tubular couplings including annular sealing members at each end thereof, said tubular coupling ends slidably and sealingly mounted within said passage openings of said adjacent mounting plates; a pressure applying means for clamping said first and said second mounting plates together when said plurality of stacks of semiconductors are supported therebetween so that operative contact pressure is provided for each of said semiconductor end electrodes; and means for connecting the mounting plate passages and said tubular couplings in a continuous conduit path for conducting a cooling liquid through said mounting assembly.

Claim 11

A mounting assembly for a polyphase frequency converter power supply circuit including three axially aligned and symmetrically spaced stacks of pressure contact semiconductors having oppositely disposed flat end electrodes in which the semiconductors of each stack are poled in a common direction of polarity, said mounting assembly comprising: a plurality of first mounting plates formed of a solid conductive material having opposite flat side surfaces terminating in an edge surface, said side surfaces including locations for respectively supporting two groups of axially adjacent semiconductors included in said three stacks of semiconductors, and said first mounting plates further including a first electrical terminal means; a plurality of second mounting plates respectively including an insulating body portion and three conductive inserts having flat side portions, said insulating body portion having three spaced notches respectively including a shape complementary to the shape of said conductive inserts, said conductive inserts being mounted within said three notches with said flat side portions having locations disposed for engaging and supporting a pair of adjacent semiconductors respectively included in one said stacks of semiconductors said conductive inserts further including a second electrical terminal means; said first and said second mounting plates including internal passages for conducting a liquid coolant, said passages being formed by intersecting holes drilled into the edge surface of each of said first and said second mounting plates to provide a continuous conduit path adjacent the locations for supporting adjacently disposed semiconductors, said passages terminating at first and second axially extending passage openings respectively extending into opposite sides of each of said first and second mounting plates; means mounting each of said semiconductors between one of said first mounting plates and one of said conductive inserts at said supporting locations so that said first and said second mounting plates are alternately disposed for supporting respectively the opposite ends of said semiconductors with a like pair of end mounting plates being provided at the opposite ends of said stacks of semiconductors, the alternately disposed first and second mounting plates having said first and second passage openings of respectively adjacent mounting plates being oppositely disposed and in axially aligned relationship; means for circulating a liquid coolant through said mounting plate passages including a plurality of tubular couplings including annular sealing members at each end thereof, said ends of each tubular coupling reciprocably and sealingly mounted within oppositely disposed passage openings thereby interconnecting said passages of each mounting plate, and means for interconnecting the outer passage openings of said end mounting plates so that a liquid coolant can be circulated adjacent each of said semiconductors; a pressure-applying means including a tie rod means spaced symmetrically with respect tO said three stacks of semiconductors and including first and second portions respectively disposed on the outer sides of each of said end mounting plates, and a clamping means being disposed on said tie rod means on the outer side of said end mounting plates for applying force to the end mounting plates so that pressure is applied to the ends of the said semiconductor stacks whereby operative contact pressure is provided at the end electrodes of each of said semiconductors; a three phase conductor means for providing an input to said power supply circuit from a three phase electrical source, said three phase conductor means including a conductor of each phase respectively connected to said second electrical terminal means of the conductive portions of said second mounting plates respectively supporting one of said semiconductor stacks; and a plurality of output conductor means respectively connected to said first electrical terminal means of said first mounting means for connecting said power supply circuit to an electrical load.

Claim 12

A mounting assembly for a polyphase frequency converter power supply circuit including three axially aligned and symmetrically spaced stacks of pressure contact semiconductors having oppositely disposed flat end electrodes in which the semiconductors of each stack are poled in a common direction of polarity, said mounting assembly comprising: a plurality of first mounting plates formed of a solid conductive material having opposite flat side surfaces terminating in an edge surface, said side surfaces including locations for respectively supporting two groups of axially adjacent semiconductors included in said three stacks of semiconductors, and said first mounting plates further including a first electrical terminal means; a plurality of second mounting plates respectively including an insulating body portion and three conductive inserts having flat side portions, said insulating body portion having three spaced notches respectively including a shape complementary to the shape of said conductive inserts, said conductive inserts being mounted within said three notches with said flat side portions having locations disposed for engaging and supporting a pair of adjacent semiconductors respectively included in one said stacks of semiconductors said conductive inserts further including a second electrical terminal means; said first and said second mounting plates including internal passages for conducting a liquid coolant, said passages being formed by intersecting holes drilled into the edge surface of each of said first and said second mounting plates to provide a continuous conduit path adjacent the locations for supporting adjacently disposed semiconductors, said passages terminating at first and second axially extending passage openings respectively extending into opposite sides of each of said first and second mounting plates; means mounting each of said semiconductors between one of said first mounting plates and one of said conductive inserts at said supporting locations so that said first and said second mounting plates are alternately disposed for supporting respectively the opposite ends of said semiconductors with a like pair of end mounting plates being provided at the opposite ends of said stacks of semiconductors, the alternately disposed first and second mounting plates having said first and second passage openings of respectively adjacent mounting plates being oppositely disposed and in axially aligned relationship; means for circulating a liquid coolant through said mounting plate passages including a plurality of tubular couplings including annular sealing members at each end thereof, said ends of each tubular coupling reciprocably and sealingly mounted within oppositely disposed passage openings thereby interconnecting said passages of each mounting plate, and means for interconnecting the outer passage openings of said end mounting plates so that a liquid coolant can be circulated adjacent each of said semiconductors; a pressure-applying means including a tie rod means spaced symmetrically with respect tO said three stacks of semiconductors and including first and second portions respectively disposed on the outer sides of each of said end mounting plates, and a clamping means being disposed on said tie rod means on the outer side of said end mounting plates for applying force to the end mounting plates so that pressure is applied to the ends of the said semiconductor stacks whereby operative contact pressure is provided at the end electrodes of each of said semiconductors; a three phase conductor means for providing an input to said power supply circuit from a three phase electrical source, said three phase conductor means including a conductor of each phase respectively connected to said second electrical terminal means of the conductive portions of said second mounting plates respectively supporting one of said semiconductor stacks; and a plurality of output conductor means respectively connected to said first electrical terminal means of said first mounting means for connecting said power supply circuit to an electrical load.