Apparatus for depositing semiconductor material and forming semiconductor junctions
Abstract
Abstract THERE IS DISCLOSED AN APPARATUS FOR SPUTTER DEPOSITING A LAYER OF SEMICONDUCTOR MATERIAL FROM A CATHODE ONTO A SEMICONDUCTOR SUBSTRATE THROUGH A MOLTEN METAL ALLOY LAYER ON THE SUBSTRATE. MEANS ARE PROVIDED TO SENSE THE TEMPERATURE OF THE SUBSTRATE IN ORDER TO CONTROL MEANS FOR SHIELDING THE ALLOY LAYER UNTIL THE SUBSTRATE REACHES A TEMPERATURE SUCH THAT THE SURFACE OF THE SUBSTRATE ITSELF IS SLIGHTLY BELOW THE MELTING POINT OF THE MATERIAL TO BE DEPOSITED WHEREAS THE SURFACE OF THE MOLTEN LAYER IS MAINTAINED BY THE SPUTTERING APPARATUS AT A TEMPERATURE WHICH IS ABOVE THE MELTING POINT OF THE MATERIAL TO BE SPUTTER DEPOSITED. THE APPARATUS THUS ASSURES THAT THE SPUTTERED MATERIAL WILL DISSOLVE INTO THE ALLOY AT ITS HIGH TEMPERATURE SURFACE AND CRYSTALLIZE ONTO THE SURFACE OF THE SUBSTRATE.
Inventors
- 👤 Murray Bloom
Bibliographic Details
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