US3568831A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Chip-classifying apparatus
Assignee: Aerojet Rocketdyne Inc
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Filing: 1969-01-06
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Granted: 1971-03-09
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Expires: 1989-01-06
Abstract
Abstract According to the present disclosure, chip-classifying apparatus is provided with a platen having conductive film contacts in a configuration conforming to the contact configuration of the chip device to be classified. The platen is mounted at a test station and is electrically connected to suitable test apparatus. Motive means is provided for moving the chips to the test station and thereafter to a depository station. The motive means includes a tubular vacuum needle connected to a source of reduced pressure. A funnel is mounted to the open end of the vacuum needle, which funnel has a configuration and size conforming to that of the chip being moved so that the chip is oriented by reaction against the funnel to an orientation compatible with the contact configuration of the platen.
Inventors
- 👤 Mortimer Penberg
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-25 18:25
CPC Classifications
B; B07; B07C; B07C5/00; B07C5/34; B07C5/344; Y; Y10; Y10S; Y10S209/00; Y10S209/905; Y10S209/931
Claims Analysis
Total Claims: 14
Claim 1
Independent Claim
151 words
In apparatus for classifying chip devices in accordance with their electrical characteristics which apparatus comprises a first station for supplying unclassified chip devices having a plurality of electrical contacts, a second station where such chip devices are to be classified, and a third station where the classified chip devices are deposited, and motive means for moving the chip devices between the first, second and third stations, the improvement comprising: an insulative substrate mounted at said second station, a plurality of conductive film contacts on said substrate in spaced relation, said film contacts containing a plurality of crystals providing a rough surface on each film contact, said film contacts being so arranged and disposed and being so sized relative to the chip device contacts as to be capable of making electrical connection with individual contacts on the chip device, and means adapted to connect each of said film contacts to test apparatus.
Claim 2
Dependent Claim
151 words
In apparatus for classifying chip devices in accordance with their electrical characteristics which apparatus comprises a first station for supplying unclassified chip devices having a plurality of electrical contacts, a second station where such chip devices are to be classified, and a third station where the classified chip devices are deposited, and motive means for moving the chip devices between the first, second and third stations, the improvement comprising: an insulative substrate mounted at said second station, a plurality of conductive film contacts on said substrate in spaced relation, said film contacts containing a plurality of crystals providing a rough surface on each film contact, said film contacts being so arranged and disposed and being so sized relative to the chip device contacts as to be capable of making electrical connection with individual contacts on the chip device, and means adapted to connect each of said film contacts to test apparatus.
Claim 3
Dependent Claim
88 words
Apparatus according to claim 1, wherein said motive means comprises a hollow needle adapted to be connected to a source of reduced pressure; and a funnel connected to a free end of said needle, said funnel having inclined walls in a configuration similar to the chip devices and being sized relative to the chip devices as to hold an individual chip device within said funnel, said funnel orienting each chip device relative to the substrate so that the chip contacts will make electrical connection with the film contacts.
Claim 4
Dependent Claim
14 words
Apparatus according to claim 2, wherein said substrate is mounted on a resilient support.
Claim 5
Dependent Claim
25 words
Apparatus according to claim 1 wherein said crystals are alumina crystals, and said film contacts comprises a layer of hard metal formed over the substrate.
Claim 6
Dependent Claim
21 words
Apparatus according to claim 2 having means supporting said substrate for aligning the substrate and the chip device into coplanar relationship.
Claim 7
Dependent Claim
14 words
Apparatus according to claim 1, wherein said substrate is mounted on a resilient support.
Claim 8
Dependent Claim
25 words
Apparatus according to claim 6, wherein said crystals are alumina crystals, and said film contacts comprises a layer of hard metal formed over the substrate.
Claim 9
Dependent Claim
26 words
Apparatus according to claim 7, wherein said layer of hard metal is a thin film of metal selected from the group comprising rhodium, palladium and osmium.
Claim 10
Dependent Claim
21 words
Apparatus according to claim 1, having means supporting said substrate for aligning the substrate and the chip device into coplanar relationship.
Claim 11
Dependent Claim
219 words
In apparatus for classifying chip devices in accordance with their electrical characteristics which apparatus comprises a first station for supplying unclassified chip devices having a plurality of electrical contacts, a second station where such chip devices are to be classified, and a third station where the classified chip devices are deposited, and motive means for moving the chip devices between the first, second and third stations, the improvement comprising: an insulative substrate having a plurality of conductive film contacts in spaced relation; resilient support means mounting said insulative substrate at said second station; said film contacts being so arranged and disposed and being so sized relative to the chip device contacts as to be capable of making electrical connection with individual contacts on a chip device; means adapted to connect each of said film contacts to test apparatus; said motive means comprising a hollow needle to be connected to a source of reduced pressure, and a funnel connected to the free end of said needle said needle having inclined walls in a configuration similar to the chip devices and being sized relative to the chip devices as to hold an individual chip device within said funnel, said funnel orienting said chip device relative to said substrate so that the chip contacts will make electrical connection with the film contActs.
Claim 12
Dependent Claim
219 words
In apparatus for classifying chip devices in accordance with their electrical characteristics which apparatus comprises a first station for supplying unclassified chip devices having a plurality of electrical contacts, a second station where such chip devices are to be classified, and a third station where the classified chip devices are deposited, and motive means for moving the chip devices between the first, second and third stations, the improvement comprising: an insulative substrate having a plurality of conductive film contacts in spaced relation; resilient support means mounting said insulative substrate at said second station; said film contacts being so arranged and disposed and being so sized relative to the chip device contacts as to be capable of making electrical connection with individual contacts on a chip device; means adapted to connect each of said film contacts to test apparatus; said motive means comprising a hollow needle to be connected to a source of reduced pressure, and a funnel connected to the free end of said needle said needle having inclined walls in a configuration similar to the chip devices and being sized relative to the chip devices as to hold an individual chip device within said funnel, said funnel orienting said chip device relative to said substrate so that the chip contacts will make electrical connection with the film contActs.
Claim 13
Dependent Claim
21 words
Apparatus according to claim 10, wherein said substrate contains a plurality of crystals providing a rough surface for each film contact.
Claim 14
Dependent Claim
25 words
Apparatus according to claim 11, wherein said crystals are alumina crystals, and said film contacts comprises a layer of hard metal formed over the substrate.
References Cited (Backward Citations)
US3384236A
Cited
US3479716A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1974-03-08 | 1974-09-07 | 1975-03-09 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1978-03-08 | 1978-09-07 | 1979-03-09 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1982-03-08 | 1982-09-07 | 1983-03-09 | $7700.00 | Window Closed / Lapsed |