US3566204A
Expired / Lapsed
US
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Ceramic chip capacitor having coplanar surfaces
Assignee: Duracell Inc USA
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Filing: 1969-04-04
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Granted: 1971-02-23
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Expires: 1989-04-04
Abstract
Abstract A ceramic chip electrical capacitor, primarily for use in hybrid integrated circuits. The capacitor has a body of one type conductivity ceramic material with a pair of embossed coplanar surfaces and a groove separating the surfaces. A layer of electrically conductive material is upon each of the coplanar surfaces forming electrodes on the respective surfaces. The electrodes include dopant material, productive of the other type conductivity in the ceramic material, diffused into the surfaces to form a PN-junction dielectric region in each of the surfaces beneath the respective electrodes.
Inventors
- 👤 James P Callahan
- 👤 Richard A Stark
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-09 02:44
CPC Classifications
H; H01; H01G; H01G2/00; H01G2/02; H01G2/06; H01G2/065; H01G4/00; H01G4/002; H01G4/005; H01G4/008; H01G4/0085; H05; H05K; H05K1/00; H05K1/02; H05K1/03; H05K1/0306; H05K3/00; H05K3/0097
Claims Analysis
Total Claims: 25
Claim 1
Independent Claim
82 words
A ceramic chip electrical capacitor, comprising a body of one type conductivity semiconductive ceramic material having a pair of embossed coplanar surfaces and a groove in said body separating said surfaces, a layer of electrically conductive material upon each of said coplanar surfaces forming electrodes on the surfaces respectively, said electrodes including dopant material, productive of the other type conductivity in said ceramic material, diffused into said surfaces and forming PNjunction dielectric region in each of said surfaces beneath the electrodes respectively.
Claim 2
Dependent Claim
82 words
A ceramic chip electrical capacitor, comprising a body of one type conductivity semiconductive ceramic material having a pair of embossed coplanar surfaces and a groove in said body separating said surfaces, a layer of electrically conductive material upon each of said coplanar surfaces forming electrodes on the surfaces respectively, said electrodes including dopant material, productive of the other type conductivity in said ceramic material, diffused into said surfaces and forming PNjunction dielectric region in each of said surfaces beneath the electrodes respectively.
Claim 3
Dependent Claim
13 words
The capacitor of claim 1 wherein said ceramic material is an oxide ceramic.
Claim 4
Dependent Claim
23 words
The capacitor of claim 2 wherein said oxide ceramic is selected from the class consisting of alkaline earth titanates, zirconates and titanium dioxide.
Claim 5
Dependent Claim
13 words
The capacitor of claim 1 wherein said electrode material contains a bonding agent.
Claim 6
Dependent Claim
23 words
The capacitor of claim 1 wherein said electrode material contains a metal selected from the class consisting of silver, palladium, platinum and gold.
Claim 7
Dependent Claim
49 words
A ceramic chip electrical capacitor, comprising a body of chemically reduced, semiconducting oxide ceramic filler having a plurality of embossed, coplanar surfaces and a substantially U-shaped groove, and a semiconductor-dopant material diffused into said coplanar surfaces forms a PN junction in said body beneath each of said coplanar surfaces.
Claim 8
Dependent Claim
49 words
A ceramic chip electrical capacitor, comprising a body of chemically reduced, semiconducting oxide ceramic filler having a plurality of embossed, coplanar surfaces and a substantially U-shaped groove, and a semiconductor-dopant material diffused into said coplanar surfaces forms a PN junction in said body beneath each of said coplanar surfaces.
Claim 9
Dependent Claim
17 words
The capacitor of claim 6 wherein portions of the ceramic material of said body are partially reoxidized.
Claim 10
Dependent Claim
17 words
The capacitor of claim 7 wherein said PN junctions are graded as a result of said reoxidation.
Claim 11
Dependent Claim
36 words
A ceramic chip electrical component, comprising a body of ceramic material, said body having a plurality of coplanar surfaces and at least one groove separating said surfaces, and an electrode layer bonded to said coplanar surfaces.
Claim 12
Dependent Claim
36 words
A ceramic chip electrical component, comprising a body of ceramic material, said body having a plurality of coplanar surfaces and at least one groove separating said surfaces, and an electrode layer bonded to said coplanar surfaces.
Claim 13
Dependent Claim
22 words
The component of claim 9 wherein said ceramic has semiconducting properties, and wherein said electrode layer is diffused into said coplanar surfaces.
Claim 14
Dependent Claim
22 words
The component of claim 10 further comprising a plurality of rectifying junctions located in said semiconducting ceramic body beneath said coplanar surfaces.
Claim 15
Dependent Claim
12 words
A component according to claim 11 having a nonlinear electrically resistive characteristic.
Claim 16
Dependent Claim
15 words
The component of claim 9 wherein at least one of said grooves is substantially U-shaped.
Claim 17
Dependent Claim
19 words
The component of claim 9 wherein said body has an essentially flat and featureless surface opposite said coplanar surfaces.
Claim 18
Dependent Claim
12 words
A component according to claim 9 having a controlled electrically resistive characteristic.
Claim 19
Dependent Claim
50 words
A ceramic wafer having therein a plurality of electrical components, said wafer comprising an embossed ceramic substrate having a plurality of coplanar surfaces and a plurality of reticulate grooves separating said surfaces and defining said components, and an electrode layer of an electrically conductive material bonded to said coplanar surfaces.
Claim 20
Dependent Claim
50 words
A ceramic wafer having therein a plurality of electrical components, said wafer comprising an embossed ceramic substrate having a plurality of coplanar surfaces and a plurality of reticulate grooves separating said surfaces and defining said components, and an electrode layer of an electrically conductive material bonded to said coplanar surfaces.
Claim 21
Dependent Claim
19 words
The wafer of claim 16 wherein the grooves of a reticulate set of said reticulate grooves are substantially V-shaped.
Claim 22
Dependent Claim
19 words
The wafer of claim 16 wherein the grooves of a spaced series of said reticulate grooves are substantially U-shaped.
Claim 23
Dependent Claim
55 words
A ceramic wafer having a plurality of electrical components, said wafer comprising a reduced, semiconducting ceramic substrate having a plurality of coplanar surfaces and a groove separating said surfaces, a layer of electrically conductive material diffused into said coplanar surfaces, and a plurality of PN junctions each of which underlies one of said coplanar surfaces.
Claim 24
Dependent Claim
55 words
A ceramic wafer having a plurality of electrical components, said wafer comprising a reduced, semiconducting ceramic substrate having a plurality of coplanar surfaces and a groove separating said surfaces, a layer of electrically conductive material diffused into said coplanar surfaces, and a plurality of PN junctions each of which underlies one of said coplanar surfaces.
Claim 25
Dependent Claim
14 words
The wafer of claim 19 wherein portions of said ceramic substrate are partialLy reoxidized.
References Cited (Backward Citations)
No citation records indexed.
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1974-02-22 | 1974-08-24 | 1975-02-23 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1978-02-22 | 1978-08-24 | 1979-02-23 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1982-02-22 | 1982-08-24 | 1983-02-23 | $7700.00 | Window Closed / Lapsed |