Plug-in diode having conductive metallic caps and homogeneous encapsulation medium

Claim 1

A molded plug-in type electrical device comprising: a sealed semiconductor device having first and second conductive leads extending therefrom and extending axially in opposite directions and along a common axis; a homogeneous molded elongated body of insulating material surrounding said sealed semiconductor device and in contact with the full surface area of said sealed device; said homogeneous molded elongated body extending axially along substantially the full length of said first and second conductive leads and in contact with the full peripheral surface of said first and second leads; first and second metallic caps secured to and surrounding the opposite ends of said homogeneous molded elongated body; first metallic cap electrically connected to said first conductive lead; said second metallic cap electrically connected to said second conductive lead; the ends of said first and second metallic caps each having central inwardly indented portions and openings located in each of said indented portions; said first and second conductive leads extending through said openings in said first and second metallic caps, respectively; and first and second solder masses in said indented portions of said first and second metallic caps connecting said first and second conductive leads to said first and second metallic caps, respectively; said first and second conductive leads terminating at the outer surface of said first and second metallic caps, respectively.