US3565306A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Method for dicing and cleaning semiconductor slices
Assignee: Nortel Networks Ltd
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Filing: 1969-04-28
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Granted: 1971-02-23
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Expires: 1989-04-28
Abstract
Abstract A scribed semiconductor slice is placed scribed side down on a perforated cleaving stage. The slice, covered with a protective plastic film, is held in place by vacuum applied through the stage, while a cleaving bar is stepped across the slice top to dice the slice. A vacuum holder then picks up the dice and moves them into a cover so that the holder and cover together form a cleaning chamber. Cleaning gas is passed through the chamber to clean the dice, and the holder then transports them back to another vacuum holder which in turn transports them to a storage container where they are deposited scribed side up.
Inventors
- 👤 Jacques R St Louis
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-02 18:45
CPC Classifications
H; H10; H10P; H10P52/00; Y; Y10; Y10T; Y10T225/00; Y10T225/10; Y10T225/12; Y10T225/30; Y10T225/307; Y10T225/321; Y10T225/325
Claims Analysis
Total Claims: 10
Claim 1
Independent Claim
225 words
The process of dicing a thin brittle slice of semiconductor material or the like having a first scribed face containing a number of scribe lines arranged in a predetermined pattern, said slice having a second face opposing said scribed face, said process comprising the steps of: a. placing said slice on a perforated cleaving stage with said scribed face down, and holding said slide on said cleaving stage by applying a vacuum to the perforations of said stage; b. cleaving said slice along said scribe lines to form dice; c. applying a first vacuum holder having a screen to said second face of said dice such that said screen is in contact with said dice, breaking the vacuum applied through said cleaving stage; and applying vacuum to said holder to retain said dice therein; d. lifting said holder with said dice and clamping said holder to a cover thereby forming a chamber in which said dice are supported, and breaking said vacuum applied to said holder; e. passing a cleaning gas through said chamber for a predetermined time to remove particles of dust caused by cleaving said disc; f. unclamping and removing said cover and reapplying vacuum to said holder; and g. placing said holder on a selected receptacle, and breaking the vacuum applied to said holder to deposit said dice on said selected receptacle.
Claim 2
Dependent Claim
225 words
The process of dicing a thin brittle slice of semiconductor material or the like having a first scribed face containing a number of scribe lines arranged in a predetermined pattern, said slice having a second face opposing said scribed face, said process comprising the steps of: a. placing said slice on a perforated cleaving stage with said scribed face down, and holding said slide on said cleaving stage by applying a vacuum to the perforations of said stage; b. cleaving said slice along said scribe lines to form dice; c. applying a first vacuum holder having a screen to said second face of said dice such that said screen is in contact with said dice, breaking the vacuum applied through said cleaving stage; and applying vacuum to said holder to retain said dice therein; d. lifting said holder with said dice and clamping said holder to a cover thereby forming a chamber in which said dice are supported, and breaking said vacuum applied to said holder; e. passing a cleaning gas through said chamber for a predetermined time to remove particles of dust caused by cleaving said disc; f. unclamping and removing said cover and reapplying vacuum to said holder; and g. placing said holder on a selected receptacle, and breaking the vacuum applied to said holder to deposit said dice on said selected receptacle.
Claim 3
Dependent Claim
45 words
The process according to claim 1 wherein said step (b) includes placement of a soft paper disc on said stage, between said stage and said dice, said paper disc permitting passage of air therethrough and acting as a cushion to enable fracturing of said dice.
Claim 4
Dependent Claim
35 words
The process according to claim 2 wherein said paper disc, prior to its placement on said stage, is soaked in a liquid conductive of electrostatic charges, to prevent sticking of said dice to said disc.
Claim 5
Dependent Claim
11 words
The process according to claim 3 wherein said liquid is Freon.
Claim 6
Dependent Claim
47 words
The process according to claim 3 wherein said step (b) includes the steps of covering said slice with a thin, flexible sheet, then moving a cleaving edge across said slice and pressing said cleaving edge down over each of said scribe lines, and then removing said sheet.
Claim 7
Dependent Claim
33 words
A process according to claim 5 wherein, after said slice is covered with said thin, flexible sheet, said vacuum applied to said cleaving stage is temporarily interrupted to remove wrinkles from said sheet.
Claim 8
Dependent Claim
58 words
A process according to claim 6 wherein, before said holder is placed on said selected receptacle, a soft paper disc is placed on the scribed face of said disc in said holder and is retained in position by the vacuum applied to said holder, to protect said scribed face upon deposit of said dice in said selected receptacle.
Claim 9
Dependent Claim
96 words
A process according to claim 5 wherein, prior to said step (d), said flexible sheet is removed, and in said step (d), said holder is inverted so that said scribed face is up, Said vacuum being broken just before said holder is brought into engagement with said cover, so that said dice rest on said holder by gravity, and wherein, in said step (e), the flow of said cleaning gas is diffused before it reaches said dice and is passed past said dice from said cover to said holder to avoid lifting and disturbing said dice.
Claim 10
Dependent Claim
81 words
A process according to claim 1 wherein said selected receptacle is a second vacuum holder, said process further comprising the steps of applying vacuum to said second holder to retain said dice therein, inverting said second holder and placing it against a container having a flat, polished support surface with said dice against said support surface, removing the vacuum applied to said second holder, and removing said second holder, leaving said dice on said support surface with said scribed face uppermost.
References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1974-02-22 | 1974-08-24 | 1975-02-23 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1978-02-22 | 1978-08-24 | 1979-02-23 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1982-02-22 | 1982-08-24 | 1983-02-23 | $7700.00 | Window Closed / Lapsed |