US3559282A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Method for making thin semiconductor dice
Assignee: Motorola Solutions Inc
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Filing: 1968-09-03
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Granted: 1971-02-02
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Expires: 1988-09-03
Abstract
Abstract A PROCESS FOR MAKING THIN SEMICONDUCTOR DEVICES WHEREIN THE SEMICONDUCTOR WAFER STARTING MATERIAL IS INITIALLY LAPPED TO A VERY THIN VALUE. GLASS AND A DUMMY SUBSTRATE ARE THEN SANDWICHED TO THE WAFER FOR FURTHER PROCESSING AND TO PREVENT BREAKAGE OF THE WAFER WHEN SEMICONDUCTOR DEVICES SUCH AS TRANSISTORS ARE CONSTRUCTED THEREIN. THEN THE GLASS AND DUMMY SUBSTRATE ARE REMOVED, LEAVING THIN SEMICONDUCTOR DICE HAVING A VERY LOW THERMAL RESISTANCE TO HEAT EMANATING FROM PN JUNCTIONS THEREIN.
Inventors
- 👤 Israel A Lesk
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-26 10:20
CPC Classifications
H; H10; H10D; H10D89/00; H10D89/10; H10D89/105; H10D99/00; H10W; H10W10/00; H10W10/01; H10W10/011; H10W10/019; H10W10/10; Y; Y10; Y10S; Y10S148/00; Y10S148/028; Y10S148/043; Y10S148/051; Y10S148/085; Y10S438/00; Y10S438/977
Claims Analysis
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References Cited (Backward Citations)
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1974-02-01 | 1974-08-03 | 1975-02-02 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1978-02-01 | 1978-08-03 | 1979-02-02 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1982-02-01 | 1982-08-03 | 1983-02-02 | $7700.00 | Window Closed / Lapsed |