US3557430A
Expired / Lapsed
US
⏱️ 0.0 years remaining
De-soldering apparatus
Assignee: RCA Corp
•
Filing: 1968-08-21
•
Granted: 1971-01-26
•
Expires: 1988-08-21
Abstract
Abstract THE DISCLOSED INVENTION RELATES TO APPARATUS FOR REMOVING A COMPONENT, SUCH AS AN INTEGRATED CIRCUIT, FROM A SUBSTRATE, SUCH AS A PRINTED CIRCUIT BOARD, TO WHICH IT HAS BEEN SOLDER SECURED. APPARATUS IN ACCORDANCE WITH THE PRESENT INVENTION COMPRISES A HEAT SOURCE, MEANS FOR DISPOSING THE SOLDER CONNECTIONS PROXIMATE TO SAID HEAT SOURCE, AND MEANS FOR EFFECTUATING THE REMOVAL OF THE COMPONENT FROM THE SUBSTRATE WHEN THE SOLDER CONNECTIONS ARE CAUSED TO REFLOW.
Inventors
- 👤 James B Jones
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-03 11:39
CPC Classifications
B; B23; B23K; B23K1/00; B23K1/018; Y; Y10; Y10T; Y10T29/00; Y10T29/49; Y10T29/49002; Y10T29/49117; Y10T29/49124; Y10T29/4913; Y10T29/49131; Y10T29/49815; Y10T29/49822; Y10T29/53; Y10T29/53274
Claims Analysis
Total Claims: 0
No claims parsed yet. Click Sync Now above to re-index claims from Google Patents.
References Cited (Backward Citations)
No citation records indexed.
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1974-01-25 | 1974-07-27 | 1975-01-26 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1978-01-25 | 1978-07-27 | 1979-01-26 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1982-01-25 | 1982-07-27 | 1983-01-26 | $7700.00 | Window Closed / Lapsed |