Tack bonding of coverlay

Abstract

Abstract AN APPARATUS AND TECHNIQUE FOR ENCAPSULATING A PRINTED WIRING ARRAY WHEREIN THE CONDUCTORS ARE DISPOSED UPON THE EXPOSED SURFACE OF A FLEXIBLE SUBSTRATE, THE ENCAPSULATING COVERLAY BEING A FLEXIBLE COVERLAY OR COVERING FILM HAVING A SURFACE ARRANGED TO ESTABLISH A BOND WITH THE EXPOSED SURFACE AND CONDUCTORS. THE APPARATUS AND TECHNIQUE INCLUDES A MEANS FOR ESTABLISHING A NIP ZONE BETWEEN FIRST AND SECOND PRESSURE MEMBERS, SUCH AS ROLLERS, AND FURTHER INCLUDES MEANS FOR DELIVERING A PRINTED WIRING WHICH IS MOUNTED ON A SUBSTRATE AND A FLEXIBLE COVERLAY FILM FOR THE MOUNTED WIRING INTO THE NIP ZONE SIMULTANEOUSLY. IN ADDITION, AT LEAST ONE OF THE PRESSURE MEMBERS IS PROVIDED WITH A RAISED RETICULATE PATTERN (OF SUBSTANTIALLY CONTINUOUS CONFIGURATION) HAVING INTERSECTING LONGITUDINAL AND TRANSVERSE RECESSED SEGMENTS SO AS TO FORM A PLURITY OF SUBSTANTIALLY ISOLATED AND CLOSED TACK BONDED ZONES EXISTING BETWEEN THE EXPOSED SURFACE AND THE BONDING SURFACE. THE TACK BONDED MATERIAL MAY THEREAFTER BE FIRMLY BOUNDED TOGETHER OVER THE ENTIRE AREA OF CONTACT.

Inventors

• 👤 John S Strobel

Bibliographic Details