US3555669A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Process for soldering silicon wafers to contacts
Assignee: Infineon Technologies Americas Corp
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Filing: 1967-12-15
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Granted: 1971-01-19
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Expires: 1987-12-15
Abstract
Abstract A PURE ALUMINUM DISC IS ALLOYED TO AN N-TYPE SILICON WAFER UNTIL A SILICON-ALUMINUM EUTECTIC IS REACHED, RESULTING IN A SOFT, GAP-FREE ALLOY WHICH IS READILY ALLOYED TO A CONDUCTIVE CONTACT PLATE.
Inventors
- 👤 William H Tarn
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-27 13:07
CPC Classifications
H; H10; H10W; H10W72/00; H10W72/30; H10W72/071; H10W72/073; H10W72/07331; H10W72/07336
Claims Analysis
Total Claims: 0
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References Cited (Backward Citations)
No citation records indexed.
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1974-01-18 | 1974-07-20 | 1975-01-19 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1978-01-18 | 1978-07-20 | 1979-01-19 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1982-01-18 | 1982-07-20 | 1983-01-19 | $7700.00 | Window Closed / Lapsed |