US3554793A
Expired / Lapsed
US
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Method of applying a discrete layer of metallic substance over a metal pattern on an insulating carrier
Assignee: Siemens AG
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Filing: 1968-02-20
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Granted: 1971-01-12
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Expires: 1988-02-20
Abstract
Abstract SOLDERING MATERIAL IS SPRAYED OVER AN ELECTRICAL CIRCUIT PATTERN POSITIONED ON AN INSULATING CARRIER. THE SOLDER IS IN THE LIQUID STATE, BUT IS BELOW THE TEMPERATURE AT WHICH THE SOLDER FORMS AN ALLOY WITH THE METAL CIRCUIT PATTERN. THE LAYER OF SOLDER IS THEN HEATED TO ITS ALLOYING TEMPERATURE CAUSING THE SOLDER TO CNTRACT, BY SURFACE TENSION, ONTO THE METAL CIRCUIT PATTERN FORMING AN ALLOY THEREWITH AND LEAVING THE INSULATING CARRIER SUBSTANTIALLY FREE OF SOLDER, WHICH COULD CAUSE A SHORT CIRCUIT.
Inventors
- 👤 Friedrich Krieger
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-28 16:49
CPC Classifications
H; H05; H05K; H05K3/00; H05K3/30; H05K3/32; H05K3/34; H05K3/3465; H05K3/3468; B; B23; B23K; B23K1/00; B23K1/20; B23K2101/00; B23K2101/36; B23K2101/42; H05K2201/00; H05K2201/10; H05K2201/10227; H05K2201/1028; H05K2203/00; H05K2203/04; H05K2203/044; H05K2203/07; H05K2203/0703; H05K2203/0723; H05K2203/11; H05K2203/1105
Claims Analysis
Total Claims: 0
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References Cited (Backward Citations)
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1974-01-11 | 1974-07-13 | 1975-01-12 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1978-01-11 | 1978-07-13 | 1979-01-12 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1982-01-11 | 1982-07-13 | 1983-01-12 | $7700.00 | Window Closed / Lapsed |