US3553828A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Lead assembly structure for semiconductor devices
Assignee: RCA Corp
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Filing: 1967-11-22
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Granted: 1971-01-12
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Expires: 1987-11-22
Abstract
Abstract A TERMINAL ASSEMBLY FOR MOUNTING A SEMICONDUCTOR DIE CONTAINING A NUMBER OF ACTIVE REGIONS. CONDUCTIVE LANDS ON A SURFACE OF THE DIE ARE ELECTRICALLY CONNECTED TO THE ACTIVE REGIONS. THE TERMINAL ASSEMBLY CONSISTS OF A NUMBER OF RELATIVELY THICK TERMINAL LEADS EXTENDING RADIALLY OUTWARD FROM A COMMON CENTRAL AREA. EACH TERMINAL LEAD HAS A RELATIVELY THIN END PORTION AT THE CENTRAL AREA BONDED DIRECTLY TO A CORRESPONDING LAND ON THE SEMICONDUCTOR DIE.
Inventors
- 👤 Samuel L Starger
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-23 22:51
CPC Classifications
H; H10; H10W; H10W70/00; H10W70/40; H10W70/481; H10W72/00; H10W72/071; H10W72/072; H10W72/07231; H10W72/07236; Y; Y10; Y10T; Y10T29/00; Y10T29/49; Y10T29/49002; Y10T29/49117; Y10T29/49121
Claims Analysis
Total Claims: 0
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References Cited (Backward Citations)
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1974-01-11 | 1974-07-13 | 1975-01-12 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1978-01-11 | 1978-07-13 | 1979-01-12 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1982-01-11 | 1982-07-13 | 1983-01-12 | $7700.00 | Window Closed / Lapsed |