US3495322A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Process for bonding a silicon wafer to a ceramic substrate
Assignee: Motorola Solutions Inc
•
Filing: 1967-07-20
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Granted: 1970-02-17
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Expires: 1987-07-20
Abstract
No abstract record available.
Inventors
- 👤 Marcy B Goldstein
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-24 19:34
CPC Classifications
H; H10; H10W; H10W72/00; H10W72/30; H10W72/01; H10W72/013; H10W72/071; H10W72/073; H10W90/00; H10W90/701; H10W90/731; H10W90/734
Claims Analysis
Total Claims: 0
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References Cited (Backward Citations)
GB540991A
Cited
US2902756A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1973-02-16 | 1973-08-18 | 1974-02-17 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1977-02-16 | 1977-08-18 | 1978-02-17 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1981-02-16 | 1981-08-18 | 1982-02-17 | $7700.00 | Window Closed / Lapsed |