Method of producing semiconductor devices having connecting leads attached thereto

Claim 1

THE METHOD OF FORMING CONNECTING LEADS TO A BODY OF SEMICONDUCTOR MATERIAL HAVING A SURFACE COATED WITH AN ADHERENT LAYER OF A NON-CONDUCTIVE MATERIAL INTERSPERSED WITH CONDUCTIVE CONTACTS IN OHMIC CONNECTION WITH UNDERLYING PORTIONS OF SAID BODY INCLUDING THE STEPS OF PLACING A FIRST TEMPORARY LAYER OF MATERIAL ON PREDETERMINED PORTIONS OF THE SURFACE OF THE LAYER OF NONCONDUCTIVE MATERIAL LEAVING EXPOSED OTHER PORTIONS OF THE SURFACE OF THE LAYER OF NON-CONDUCTIVE MATERIAL AND AT LEAST PORTIONS OF THE CONDUCTIVE CONTACTS, SAID EXPOSED PORTIONS DELINEATING AREAS ON WHICH THE CONNECTING LEADS ARE TO BE FORMED, PLACING CONDUCTIVE MATERIAL ON SAID EXPOSED PORTIONS OF THE SURFACE OF THE LAYER OF NON-CONDUCTIVE MATERIAL AND THE CONDUCTIVE CONTACTS AND ON THE FIRST TEMPORARY LAYER OF MATERIAL, SUBJECTING THE ASSEMBLY TO ETCHING MATERIAL CAPABLE OF DISSOLVING THE MATERIAL OF THE FIRST TEMPORARY LAYER BUT NOT THE OTHER MATERIALS OF THE ASSEMBLY TO REMOVE THE FIRST TEMPORARY LAYER AND THE OVERLYING CONDUCTIVE MATERIAL WHEREBY CONDUCTIVE MATERIAL REMAINS ON PORTIONS OF THE SURFACE OF THE LAYER OF NONCONDUCTIVE MATERIAL AND THE CONDUCTIVE CONTACTS, PLACING A LAYER OF A SECOND CONDUCTIVE MATERIAL AND AN OVERLYING NON-CONDUCTIVE MASKING COATING ON REGIONS OF THE SURFACE OF THE LAYER OF NON-CONDUCTIVE MATERIAL TO CAUSE THE CONDUCTIVE MATERIAL ON EACH OF THE PORTIONS OF THE SURFACE OF THE LAYER OF NON-CONDUCTIVE MATERIAL AND THE CONDUCTIVE CONTACTS TO BE ELECTRICALLY CONNECTED TO THE CONDUCTIVE MATERIAL ON EVERY ONE OF THE OTHER PORTIONS, ELECTROPLATING A CONDUCTIVE MATERIAL ONTO THE EXPOSED CONDUCTIVE MATERIAL TO PROVIDE CONDUCTIVE MEMBERS OVERLYING THE PORTIONS OF THE SURFACE OF THE LAYER OF NON-CONDUCTIVE MATERIAL AND THE CONDUCTIVE CONTACTS, REMOVING SAID OVERLYING NON-CONDUCTIVE MASKING COATING, AND SUBJECTING THE ASSEMBLY TO ETCHING MATERIAL CAPABLE OF DISSOLVING SAID SECOND CONDUCTIVE MATERIAL BUT NOT THE OTHER MATERIALS OF THE ASSEMBLY TO REMOVE THE SECOND CONDUCTIVE MATERIAL.

Claim 2

THE METHOD OF FORMING CONNECTING LEADS TO A BODY OF SEMICONDUCTOR MATERIAL HAVING A SURFACE COATED WITH AN ADHERENT LAYER OF A NON-CONDUCTIVE MATERIAL INTERSPERSED WITH CONDUCTIVE CONTACTS IN OHMIC CONNECTION WITH UNDERLYING PORTIONS OF SAID BODY INCLUDING THE STEPS OF PLACING A FIRST TEMPORARY LAYER OF MATERIAL ON PREDETERMINED PORTIONS OF THE SURFACE OF THE LAYER OF NONCONDUCTIVE MATERIAL LEAVING EXPOSED OTHER PORTIONS OF THE SURFACE OF THE LAYER OF NON-CONDUCTIVE MATERIAL AND AT LEAST PORTIONS OF THE CONDUCTIVE CONTACTS, SAID EXPOSED PORTIONS DELINEATING AREAS ON WHICH THE CONNECTING LEADS ARE TO BE FORMED, PLACING CONDUCTIVE MATERIAL ON SAID EXPOSED PORTIONS OF THE SURFACE OF THE LAYER OF NON-CONDUCTIVE MATERIAL AND THE CONDUCTIVE CONTACTS AND ON THE FIRST TEMPORARY LAYER OF MATERIAL, SUBJECTING THE ASSEMBLY TO ETCHING MATERIAL CAPABLE OF DISSOLVING THE MATERIAL OF THE FIRST TEMPORARY LAYER BUT NOT THE OTHER MATERIALS OF THE ASSEMBLY TO REMOVE THE FIRST TEMPORARY LAYER AND THE OVERLYING CONDUCTIVE MATERIAL WHEREBY CONDUCTIVE MATERIAL REMAINS ON PORTIONS OF THE SURFACE OF THE LAYER OF NONCONDUCTIVE MATERIAL AND THE CONDUCTIVE CONTACTS, PLACING A LAYER OF A SECOND CONDUCTIVE MATERIAL AND AN OVERLYING NON-CONDUCTIVE MASKING COATING ON REGIONS OF THE SURFACE OF THE LAYER OF NON-CONDUCTIVE MATERIAL TO CAUSE THE CONDUCTIVE MATERIAL ON EACH OF THE PORTIONS OF THE SURFACE OF THE LAYER OF NON-CONDUCTIVE MATERIAL AND THE CONDUCTIVE CONTACTS TO BE ELECTRICALLY CONNECTED TO THE CONDUCTIVE MATERIAL ON EVERY ONE OF THE OTHER PORTIONS, ELECTROPLATING A CONDUCTIVE MATERIAL ONTO THE EXPOSED CONDUCTIVE MATERIAL TO PROVIDE CONDUCTIVE MEMBERS OVERLYING THE PORTIONS OF THE SURFACE OF THE LAYER OF NON-CONDUCTIVE MATERIAL AND THE CONDUCTIVE CONTACTS, REMOVING SAID OVERLYING NON-CONDUCTIVE MASKING COATING, AND SUBJECTING THE ASSEMBLY TO ETCHING MATERIAL CAPABLE OF DISSOLVING SAID SECOND CONDUCTIVE MATERIAL BUT NOT THE OTHER MATERIALS OF THE ASSEMBLY TO REMOVE THE SECOND CONDUCTIVE MATERIAL.