Semi-conductor construction

Claim 1

IN A SEMI-CONDUCTOR ARRANGEMENT, A CYLINDRICAL SUPPORT BASE, SAID BASE HAVING A CENTRAL PART OF REDUCED DIAMETER AT ONE END THEREOF, AN ANNULAR DISC HAVING AN INTERNAL DIAMETER SUBSTANTIALLY THE SAME AS THAT OF SAID REDUCED PART OF SAID SUPPORT BASE AND WHICH IS FITTED UPON SAID REDUCED PART, THE LENGTH OF SAID REDUCED PART AND THE THICKNESS OF SAID ANNULAR DISC BEING THE SAME SO THAT THEIR UPPER SURFACES ARE CO-PLANAR, A HARD SOLDER LAYER JOINING THE LOWER ANNULAR SURFACE OF SAID DISC TO THE ADJACENT SURFACE OF SAID SUPPORT BASE WHICH SURROUNDS SAID REDUCED PART, A CIRCULAR CARRIER PLATE OF SUBSTANTIALLY THE SAME DIAMETER AS THE EXTERNAL DIAMETER OF SAID ANNULAR DISC, A SOFT SOLDER LAYER JOINING THE UPPER CO-PLANAR SURFACES OF SAID REDUCED PART OF SAID BASE AND OF SAID ANNULAR DISC TO THE UNDER SURFACE OF SAID CARRIER PLATE, AND A SEMICONDUCTOR DISC SUPPORTED UPON THE UPPER SURFACE OF SAID CARRIER PLATE, SAID CARRIER PLATE AND ANNULAR DISCS BEING CONSTITUTED FROM A MATERIAL HAVING SUBSTANTIALLY THE SAME COEFFICIENT OF EXPANSION AND WHICH IS DIFFERENT FROM THE EXPANSION COEFFICIENT OF THE MATERIAL FROM WHICH SAID SUPPORT BASE IS MADE.