US3392440A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Scribing method for semiconductor wafers
Assignee: NEC Corp
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Filing: 1966-04-27
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Granted: 1968-07-16
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Expires: 1986-04-27
Abstract
No abstract record available.
Inventors
- 👤 Yanagawa Takayuki
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-26 05:42
CPC Classifications
B; B28; B28D; B28D5/00; B28D5/0005; B28D5/0011; Y; Y10; Y10T; Y10T225/00; Y10T225/10; Y10T225/12; Y10T29/00; Y10T29/49; Y10T29/49789; Y10T29/4979
Claims Analysis
Total Claims: 2
Claim 1
Independent Claim
57 words
IN THE PROCESS OF PRODUCING INDIVIDUAL SEMICONDUCTOR PIECES FROM A LARGER SEMICONDUCTOR WAFER BY SCRIBING AND SEPARATING THE SCRIBE BOUNDED REGIONS, THE IMPROVEMENT COMPRISING THE STEP OF: THIN FILM MAKING AT LEAST THE REGION TO BE SCRIBED WITH A WAX MATERIAL HAVING A LESSER HARDNESS AND LARGER VISCOSITY THAN THE SEMICONDUCTOR MATERIAL, AND SCRIBING THROUGH SAID FILM.
Claim 2
Dependent Claim
57 words
IN THE PROCESS OF PRODUCING INDIVIDUAL SEMICONDUCTOR PIECES FROM A LARGER SEMICONDUCTOR WAFER BY SCRIBING AND SEPARATING THE SCRIBE BOUNDED REGIONS, THE IMPROVEMENT COMPRISING THE STEP OF: THIN FILM MAKING AT LEAST THE REGION TO BE SCRIBED WITH A WAX MATERIAL HAVING A LESSER HARDNESS AND LARGER VISCOSITY THAN THE SEMICONDUCTOR MATERIAL, AND SCRIBING THROUGH SAID FILM.
References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1971-07-16 | 1972-01-15 | 1972-07-16 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1975-07-16 | 1976-01-15 | 1976-07-16 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1979-07-16 | 1980-01-15 | 1980-07-16 | $7700.00 | Window Closed / Lapsed |