Thermoelectric mosaic interconnected by semiconductor leg protrusions and metal coating

Claim 1

A THERMOELECTRIC DEVICE COMPRISING A MULTIPLICITY OF THERMOCOUPLE LEG PAIRS, EACH OF SAID LEGS IN EACH THERMOCOUPLE PAIR BEING FORMED OF SEMICONDUCTIVE MATERIAL AND HAVING A PARALLELOGRAM-SHAPED CROSS-SECTION OF THE SAME SHAPE AND SIZE AS THAT OF THE CORRESPONDING LEG IN EACH OTHER PAIR, AND ALL OF SAID LEGS HAVING THE SAME HEIGHT AND BEING ARRANGED IN A RECTANGULAR MOSAIC PATTERN WITH ALL LEGS SPACED AND INSULATED FROM EACH OTHER BUT FIRMLY JOINED TOGETHER TO JOINTLY FORM A BLOCK HAVING RESPECTIVE TOP AND BOTTOM SURFACES SUBSTANTIALLY COINCIDENT WITH RESPECTIVE TWO END FACES OF EACH LEG; AT LEAST ONE OF EACH TWO ADJACENT LEGS HAVING A MAIN BODY AND A BRIDGE PORTION INTEGRAL WITH SAID BODY, SAID BRIDGE PORTION PROTRUDING LATERALLY FROM SAID BODY AND CONTACTING THE ADJACENT LEG, SAID INTEGRAL BRIDGE PORTIONS IN SAID BLOCK FORMING AN ELECTRIC SERIES CONNECTION OF SAID LEG PAIRS, AND METAL COATINGS OF HIGH CONDUCTIVITY INSULATED FROM ONE ANOTHER ON SAID TWO BLOCK SURFACES, EACH OF SAID COATINGS COVERING ONLY ONE OF SAID RESPECTIVE BRIDGE PORTIONS AND THE CONTIGUOUS END FACES OF THE TWO LEGS INTERCONNECTED BY SAID ONE BRIDGE PORTION SO AS TO REINFORCE THE CONNECTION BETWEEN SAID TWO LEGS, SAID COATINGS HAVING A VERY SMALL THICKNESS COMPARED TO THE SURFACE AREA THEREOF.