US3371780A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Apparatus for mechanically and electrically testing the quality of bonded joints
Assignee: International Business Machines Corp
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Filing: 1966-04-25
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Granted: 1968-03-05
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Expires: 1986-04-25
Abstract
No abstract record available.
Inventors
- 👤 Clark Kendall
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-27 09:24
CPC Classifications
G; G01; G01R; G01R31/00; G01R31/50; G01R31/66; Y; Y10; Y10S; Y10S209/00; Y10S209/909
Claims Analysis
Total Claims: 2
Claim 1
Independent Claim
64 words
APPARATUS FOR TESTING THE JOINT BONDING MICROMINIATURE CHIP DEVICE TO THE SURFACE OF A SUBSTRATE OF A MICROMINIATURE MODULE COMPRISING: MEANS FOR SUPPORTING SAID MODULE; MEANS FOR SUBJECTING JOINT OF A MODULE IN SAID SUPPORT MEANS TO A BLAST OF FLUID MEDIUM; AND MEANS FOR MOVING SAID BLAST MEANS RELATIVE TO THE MODULE TO SUCCESSIVELY SUBJECT THE JOINT TO TENSILE, SHEAR AND COMPRESSIONAL FORCES.
Claim 2
Dependent Claim
64 words
APPARATUS FOR TESTING THE JOINT BONDING MICROMINIATURE CHIP DEVICE TO THE SURFACE OF A SUBSTRATE OF A MICROMINIATURE MODULE COMPRISING: MEANS FOR SUPPORTING SAID MODULE; MEANS FOR SUBJECTING JOINT OF A MODULE IN SAID SUPPORT MEANS TO A BLAST OF FLUID MEDIUM; AND MEANS FOR MOVING SAID BLAST MEANS RELATIVE TO THE MODULE TO SUCCESSIVELY SUBJECT THE JOINT TO TENSILE, SHEAR AND COMPRESSIONAL FORCES.
References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1971-03-05 | 1971-09-04 | 1972-03-05 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1975-03-05 | 1975-09-04 | 1976-03-05 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1979-03-05 | 1979-09-04 | 1980-03-05 | $7700.00 | Window Closed / Lapsed |