US3371001A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Method of applying uniform thickness of frit on semi-conductor wafers
Assignee: Vitta Corp
•
Filing: 1965-09-27
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Granted: 1968-02-27
•
Expires: 1985-09-27
Abstract
No abstract record available.
Inventors
- 👤 Kitty S Ettre
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-24 19:21
CPC Classifications
H; H10; H10W; H10W74/00; H10W74/40; H10W74/43; Y; Y10; Y10T; Y10T428/00; Y10T428/26; Y10T428/263; Y10T428/264; Y10T428/265
Claims Analysis
Total Claims: 2
Claim 1
Independent Claim
75 words
A METHOD OF COATING A PLURALITY OF SEMICONDUCTOR WAFERS WITH A FRIABLE FRIT IN THE FORM OF A LAYER ABOUT ONE MIL OR LESS THICK, WHICH COMPRISES: PRESSING A TRANSFER TAPE COMPRISING A CARRIER BASE AND THE COATING OF SAID LAYER ONTO THE SURFACE OF THE SEMICONDUCTOR WAFERS BETWEEN A PAIR OF ROLLERS AND THEREAFTER STRIPPING THE CARRIER AND ITS UNUSED COATING AWAY FROM SAID WAFERS, RESULTING IN A FRIT COATING OF UNIFORMLY APPLIED THICKNESS.
Claim 2
Independent Claim
75 words
A METHOD OF COATING A PLURALITY OF SEMICONDUCTOR WAFERS WITH A FRIABLE FRIT IN THE FORM OF A LAYER ABOUT ONE MIL OR LESS THICK, WHICH COMPRISES: PRESSING A TRANSFER TAPE COMPRISING A CARRIER BASE AND THE COATING OF SAID LAYER ONTO THE SURFACE OF THE SEMICONDUCTOR WAFERS BETWEEN A PAIR OF ROLLERS AND THEREAFTER STRIPPING THE CARRIER AND ITS UNUSED COATING AWAY FROM SAID WAFERS, RESULTING IN A FRIT COATING OF UNIFORMLY APPLIED THICKNESS.
References Cited (Backward Citations)
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1971-02-26 | 1971-08-28 | 1972-02-27 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1975-02-26 | 1975-08-28 | 1976-02-27 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1979-02-26 | 1979-08-28 | 1980-02-27 | $7700.00 | Window Closed / Lapsed |