Process for preparing arrays of magnetic circuit elements

Claim 1

THE PROCESS OF FABRICATING A CONNECTED SINTERED FERRITE ARRAY OF MAGNETIC STORAGE ELEMENTS WHICH COMPRISES: (A) DEPOSITING ON THE SURFACE OF AN ELECTRICALLY CONDUCTIVE WIRE A FIRST CONTUNUOUS COATING OF A WAX-LIKE SEPARATING MATERIAL; (B) THEREAFTER DEPOSITING ON THE SURFACE OF SAID SEPARATING MATERIAL A SECOND CONTINUOUS COATING OF A MIXTURE OF A THERMOSETTING RESIN BINDER AND A FERRITE MATERIAL; (C) MOUNTING SAID FERRITE-RESIN COATED CONDUCTIVE WIRE ON TWO SEPARATE FRAMES TO FORM THEREBY A FIRST SERIES OF PARALLEL MULTIPLE COATED CONDUCTIVE WIRES ON ONE FRAME AND A SECOND SERIES OF PARALLEL MULTIPLE COATED CONDUCTIVE WIRES ON THE REMAINING FRAME; (D) JOINING SAID WIRES INTO AN ARRAY BY CONTACTING SAID MULTIPLE COATED WIRES IN SAID FIRST SERIES WITH SAID MULTIPLE COATED WIRES IN SAID SECOND SERIES WHILE MAINTAINING SAID FERRITE-RESIN COATINGS ON SAID WIRES SUFFICIENTLY FLUID THAT THE FERRITE RESIN COATINGS INTERMINGLE AND INTIMATELY JOIN AT THE POINTS OF CONTACT; (E) HEATING THE THUS ASSEMGLED ARRAY TO A PREDETERMINED TEMPERATURE AT WHICH SAID MIXTURE OF A THERMOSETTING RESIN BINDER AND FERRITE MATERIAL IS PARTIALLY CURED AND ATTAINS SUFFICIENT MECHANICAL STRENGTH TO BECOME SEFL-SUPPORTING AND NOW CONTINUE HEATING TO A TEMPERATURE ABOVE SAID PREDETERMINED TEMPERATURE TO REMOVE SAID SEPARATING MATERIAL; (F) THEN HEATING TO PYROLYZE SAID THERMOSETTING RESIN BINDER IN SAID ASSEMBLED ARRAY; (G) THEREAFTER SINTERING SAID ASSEMBLED ARRAY BY HEATING AT A TEMPERATURE ABOVE THE PYROLYSIS TEMPERATURE SO THAT SAID FERRITE MATERIAL BECOMES POLYCRYSTALLINE IN THE FORM AND THEN COOLING BY AIR QUENCHING TO PRODUCE THEREBY THE CONNECTED SINTERED FERRITE ARRAY OF MAGNETIC STORAGE ELEMENTS.