Method and apparatus for the high speed production of magnetic films

Claim 1

APPARATUS FOR DEPOSITIING AN ELECTRODEPOSIT ONTO ONE SURFACE OF A DIELECTRIC LENGTH OF ARTICLE, INCLUDING MEANS ARRANGED TO GUIDE SAID ARTICLE THROUGH A PLURIALITY OF TREATMENT MEANS IN SEQUENCE AS FOLLOWS: MEANS FOR PRODUCING HOLES THROUGH SAID DIELECTRIC LENGTH OF ARTICLE; MEANS FOR DEPOSITING A CONDUCTIVE FILM ONTO ALL EXPOSED SURFACES OF SAID DIELECTRIC ARTICLE HAVING THEREIN TO FORM A RESISTIVE ARTICLE; AND MEANS FOR ELECTRODEPOSITING A METALLIC LAYER ONTO ONE SIDE OF SAID ARTICLE, INCLUDING ELECTROPLATING CELL MEANS ADAPTED TO CONTAIN AN APPROPRIATE ELECTROLYTE FOR DEPOSITING SAID METALLIC LAYER, ELECTRICAL CONTACT MEANS WITHIN SAID CELL MEANS OVER WHICH SAID RERESISTIVE ARTICLE MAY BE GUIDED AND SUPPORTED TO ESTABLISH ELECTRICAL CONTACT WHILE FORMING A FLUID TIGHT SEAL BETWEEN SAID CONTACT MEANS SAID ARTICLE, ELECTRODE MEANS WITHIN SAID CELL MEANS SPACED APART FROM SAID CONTACT MEANS, A CURRENT SOURCE HAVING A NEGATIVE SIDE AND A POSITIVE SIDE, MEANS FOR CONNECTING THE NEGATIVE SIDE OF SAID CURRENT SOURCE TO SAID ELECTRICAL CONTACT MEANS AND THE POSITIVE SIDE OF SAID CURRENT SOURCE TO SAID ELECTRODE MEANS, THUS MAKING THE ELECTRICAL CONTACT MEANS AND SAID RESISTIVE ARTICLE IN ELECTRICAL CONTACT THEREWITH A CATHODE AND THE ELECTRODE MEANS AN ANODE OF THE ELECTRODEPOSITING MEANS, WHEREBY SAID ELECTRODEPOSIT IS DEPOSITED ONTO ONLY THE SIDE OF SAID ARTICLE OPPOSITE TO THE ELECTRICAL CONTACT MEANS BY VIRTURE OF THE CATHODIC CURRENT PATH ESTABLISHED THROUGH THE SAID CONDUCTIVE FILM IN CONTACT WITH SAID CONTACT MEANS, AROUND THE EDGES OF AND THROUGH THE SAID HOLES IN SAID ARTICLE, AND TO SAID OPPOSITE SIDE.