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US3359461A Expired / Lapsed US ⏱️ 0.0 years remaining

Modular circuit package

Assignee: Powercube Corp
•
Filing: 1967-02-15
•
Granted: 1967-12-19
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Expires: 1987-02-15
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Abstract

No abstract record available.

Inventors

  • 👤 Chester L Schuler
  • 👤 Chapman Norman Edward

Bibliographic Details

Application Number —
Jurisdiction US
Data Source google_patents
Last Synchronized 2026-10-27 06:29
CPC Classifications
H; H05; H05K; H05K7/00; H05K7/20; H05K5/00; H05K5/04; H05K5/0091; H05K7/2089; H05K7/209

Claims Analysis

Total Claims: 2
Claim 1
Independent Claim 130 words
AN INTEGRATED ELECTRONIC MODULAR POWER CIRCUIT PACKAGE COMPRISING: A PLURALITY OF INDIVIDUAL ELECTRICALLY CONDUCTIVE, HEAT DISSIPATIVE SIDE WALL ELEMENTS; THERMALLY CONDUCTIVE, ELECTRICALLY INSULATING MEANS FOR MECHANICALLY AND THERMALLY JOINING ADJACENT ONES OF SAID SIDE WALL ELEMENTS TO FORM A RIGID UNITIZED HOLLOW HOUSING OF SUBSTANTIALLY POLYGINAL CROSS-SECTION HAVING INSULATIVELY SEPARATED AND ELECTRICALLY CONDUCTING SIDE WALLS; AND ELECTRONIC COMPONENTS CONSTITUTING A MODULAR CIRCUIT DISPOSED WITHIN SAID HOUSING, AT LEAST SOME OF SAID COMPONENTS BEING ATTACHED IN THERMAL CONTACT WITH SAID SIDE WALL ELEMENTS, THE THERMAL CONTACT PORTION OF SOME OF SAID COMPONENTS ALSO MAKING A DIRECT ELECTRICAL CONTACT WITH SELECTED ONES OF SAID SIDE WALL ELEMENTS; WHEREBY SAID SIDE WALL ELEMENTS PROVIDE PHYSICAL SUPPORT, ELECTRICAL INTERCONNECTION AND THERMAL DISSPATION FOR SAID ELECTRONIC COMPONENTS, TOGETHER WITH STRUCTURAL RIGIDITY FOR SAID MODULAR PACKAGE.
Claim 2
Dependent Claim 130 words
AN INTEGRATED ELECTRONIC MODULAR POWER CIRCUIT PACKAGE COMPRISING: A PLURALITY OF INDIVIDUAL ELECTRICALLY CONDUCTIVE, HEAT DISSIPATIVE SIDE WALL ELEMENTS; THERMALLY CONDUCTIVE, ELECTRICALLY INSULATING MEANS FOR MECHANICALLY AND THERMALLY JOINING ADJACENT ONES OF SAID SIDE WALL ELEMENTS TO FORM A RIGID UNITIZED HOLLOW HOUSING OF SUBSTANTIALLY POLYGINAL CROSS-SECTION HAVING INSULATIVELY SEPARATED AND ELECTRICALLY CONDUCTING SIDE WALLS; AND ELECTRONIC COMPONENTS CONSTITUTING A MODULAR CIRCUIT DISPOSED WITHIN SAID HOUSING, AT LEAST SOME OF SAID COMPONENTS BEING ATTACHED IN THERMAL CONTACT WITH SAID SIDE WALL ELEMENTS, THE THERMAL CONTACT PORTION OF SOME OF SAID COMPONENTS ALSO MAKING A DIRECT ELECTRICAL CONTACT WITH SELECTED ONES OF SAID SIDE WALL ELEMENTS; WHEREBY SAID SIDE WALL ELEMENTS PROVIDE PHYSICAL SUPPORT, ELECTRICAL INTERCONNECTION AND THERMAL DISSPATION FOR SAID ELECTRONIC COMPONENTS, TOGETHER WITH STRUCTURAL RIGIDITY FOR SAID MODULAR PACKAGE.

References Cited (Backward Citations)

US2999971A Cited
US3277346A Cited
US3200296A Cited

USPTO Annuity & Maintenance Windows

Annuity Stage Window Opens Payment Deadline Surcharge Period Until Estimated Fee Status
3.5 Years (Year 4) 1970-12-18 1971-06-19 1971-12-19 $2000.00 Window Closed / Lapsed
7.5 Years (Year 8) 1974-12-18 1975-06-19 1975-12-19 $3760.00 Window Closed / Lapsed
11.5 Years (Year 12) 1978-12-18 1979-06-19 1979-12-19 $7700.00 Window Closed / Lapsed

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