US3352730A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Method of making multilayer circuit boards
Assignee: Lockheed Martin Corp
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Filing: 1964-08-24
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Granted: 1967-11-14
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Expires: 1984-08-24
Abstract
No abstract record available.
Inventors
- 👤 Jr Charles J Murch
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-30 14:24
CPC Classifications
H; H05; H05K; H05K3/00; H05K3/46; H05K3/4644; H05K3/40; H05K3/42; H05K3/421; H05K2201/00; H05K2201/03; H05K2201/0332; H05K2201/0335; H05K2201/0355; H05K2201/0388; H05K2201/0394; H05K2201/09; H05K2201/09209; H05K2201/095; H05K2201/09563; H05K2203/00; H05K2203/06; H05K2203/063; H05K3/02; H05K3/06; H05K3/10; H05K3/18; H05K3/181; H05K3/22; H05K3/28; H05K3/423; H05K3/425; H05K3/427; Y; Y10; Y10S; Y10S205/00; Y10S205/92; Y10T; Y10T29/00; Y10T29/49; Y10T29/49002; Y10T29/49117; Y10T29/49124; Y10T29/4913; Y10T29/49146; Y10T29/49155
Claims Analysis
Total Claims: 2
Claim 1
Independent Claim
120 words
THE METHOD OF MAKING A MULTILAYER CIRCUIT BOARD COMPRISING THE STEPS OF: BONDING A LAYER OF INSULATION MATERIAL TO A SHEET OF METALLIC FOIL, SAID LAYER HAVING AT LEAST ONE OPENING THERETHROUGH, DEPOSITING A COATING OF ELECTRICALLY CONDUCTIVE MATERIAL ON SAID LAYER OF INSULATION TO THEREBY TOTALLY COVER AND FILL SAID OPENING AND TOTALLY COVER SAID LAYER OF INSULATION WHEREBY A LAYER OF SAID MULTILAYER CIRCUIT BOARD AND A SOLID HOMOGENEOUS INTERCONNECTION BETWEEN SAID DEPOSITED COATING AND SAID SHEET OF METALLIC FOIL ARE FORMED IN A SINGLE STEP, AND ETCHING A CIRCUIT CONFIGURATION IN SAID COATING OF ELECTRICALLY CONDUCTIVE MATERIAL, WHEREBY SAID ETCHED CIRCUIT IS ELECTRICALLY AND MECHANICALLY INTERCONNECTED BY A SOLID HOMOGENEOUS INTERCONNECTION TO SAID SHEET OF METALLIC FOIL.
Claim 2
Independent Claim
120 words
THE METHOD OF MAKING A MULTILAYER CIRCUIT BOARD COMPRISING THE STEPS OF: BONDING A LAYER OF INSULATION MATERIAL TO A SHEET OF METALLIC FOIL, SAID LAYER HAVING AT LEAST ONE OPENING THERETHROUGH, DEPOSITING A COATING OF ELECTRICALLY CONDUCTIVE MATERIAL ON SAID LAYER OF INSULATION TO THEREBY TOTALLY COVER AND FILL SAID OPENING AND TOTALLY COVER SAID LAYER OF INSULATION WHEREBY A LAYER OF SAID MULTILAYER CIRCUIT BOARD AND A SOLID HOMOGENEOUS INTERCONNECTION BETWEEN SAID DEPOSITED COATING AND SAID SHEET OF METALLIC FOIL ARE FORMED IN A SINGLE STEP, AND ETCHING A CIRCUIT CONFIGURATION IN SAID COATING OF ELECTRICALLY CONDUCTIVE MATERIAL, WHEREBY SAID ETCHED CIRCUIT IS ELECTRICALLY AND MECHANICALLY INTERCONNECTED BY A SOLID HOMOGENEOUS INTERCONNECTION TO SAID SHEET OF METALLIC FOIL.
References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1970-11-13 | 1971-05-15 | 1971-11-14 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1974-11-13 | 1975-05-15 | 1975-11-14 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1978-11-13 | 1979-05-15 | 1979-11-14 | $7700.00 | Window Closed / Lapsed |