← Back to Patent Explorer
US3337674A Expired / Lapsed US ⏱️ 0.0 years remaining

Method for polymerizing resins

Assignee: Owens Corning
•
Filing: 1964-05-27
•
Granted: 1967-08-22
•
Expires: 1984-05-27
📄 Original PDF 🌐 Google Patents 🔄 Sync Now

Abstract

No abstract record available.

Inventors

  • 👤 Ralph H Sonneborn
  • 👤 Toledo Fernando Alvarez De

Bibliographic Details

Application Number —
Jurisdiction US
Data Source google_patents
Last Synchronized 2026-11-08 23:45
CPC Classifications
B; B29; B29C; B29C53/00; B29C53/22; B29C53/24; B29C53/26; B29C33/00; B29C33/02; B29C33/04; B29C41/00; B29C41/02; B29C41/08; B29C48/00; B29C48/03; B29C48/12; B29C48/25; B29C48/88; B29C48/90; B29C48/908; B29C53/16; B29C2033/042; B29C48/07; B29C48/08; B29C48/13; B29C48/885; Y; Y10; Y10S; Y10S425/00; Y10S425/20

Claims Analysis

Total Claims: 2
Claim 1
Independent Claim 229 words
IN A METHOD OF PRODUCING A PANEL FROM A POLYMERIZABLE RESIN SYSTEM EXHIBITING A SUBSTANTIAL EXOTHERM OF POLYMERIZATION, THE STEPS OF PROVIDING A FIRST HORIZONTAL MOLD PLAT OF HEAT-CONDUCTIVE MATERIAL, HAVING UPPER AND LOWER SURFACES, FORMING A HORIZONTALLY DISPOSED WET LAYUP ON THE UPPER SURFACE OF SAID FIRST MOLD PLATE, THE LAYUP INCLUDING A LAYER OF LIQUID RESIN SYSTEM HAVING A HIGH POLYMERIZATION EXOTHERM AND INCLUDING A BOILING MONOMER COMPONENT, AND COVERING THE UPPER SURFACE OF THE LAYUP WITH A SECOND HEAT-CONDUCTIVE MOLD PLATE AND EXPOSING THE UPPER SURFACE OF SAID COVERING MOLD PLATE DIRECTLY TO A HEAT-EXCHANGE LIQUID, AND MAINTAINING THE HEAT-EXCHANGE LIQUID AT A TEMPERATURE TO INITIATE POLYMERIZATION OF THE RESIN, APPLYING HEAT-EXCHANGE LIQUID IN DIRECT CONTACT WITH THE ENTIRE LOWER SURFACE OF THE FIRST MOLD PLATE AS A UNIFORM PATTERN OF SPLASHED DROPLETS TO INTIMATELY WET SAID LOWER SURFACE AND THEREBY PROVIDE PERFECT HEAT TRANSFER WITH THE RESIN EXOTHERM WHILE MAINTAINING THE HEAT-EXCHANGE LIQUID AT A TEMPERATURE TO INITIATE POLYMERIZATION AND DEVELOP THE EXOTHERM OF THE RESIN, AND THEN TRANSFERRING EXOTHERMIC HEAT OUT OF THE POLYMERIZING RESIN AND THROUGH SAID MOLD PLATES AND BACK INTO SAID HEAT-EXCHANGE LIQUID TO MAINTAIN SAID EXOTHERM AT A TEMPERATURE LEVEL BELOW THE MONOMER BOILING POINT OF SAID RESIN SYSTEM, WHEREBY SAID ENTIRE LAYER OF RESIN IS POLYMERIZED AT ONCE AND THE EXOTHERM OF POLYMERIZATION IS CONTROLLED TO PREVENT MONOMER BOIL.
Claim 2
Dependent Claim 229 words
IN A METHOD OF PRODUCING A PANEL FROM A POLYMERIZABLE RESIN SYSTEM EXHIBITING A SUBSTANTIAL EXOTHERM OF POLYMERIZATION, THE STEPS OF PROVIDING A FIRST HORIZONTAL MOLD PLAT OF HEAT-CONDUCTIVE MATERIAL, HAVING UPPER AND LOWER SURFACES, FORMING A HORIZONTALLY DISPOSED WET LAYUP ON THE UPPER SURFACE OF SAID FIRST MOLD PLATE, THE LAYUP INCLUDING A LAYER OF LIQUID RESIN SYSTEM HAVING A HIGH POLYMERIZATION EXOTHERM AND INCLUDING A BOILING MONOMER COMPONENT, AND COVERING THE UPPER SURFACE OF THE LAYUP WITH A SECOND HEAT-CONDUCTIVE MOLD PLATE AND EXPOSING THE UPPER SURFACE OF SAID COVERING MOLD PLATE DIRECTLY TO A HEAT-EXCHANGE LIQUID, AND MAINTAINING THE HEAT-EXCHANGE LIQUID AT A TEMPERATURE TO INITIATE POLYMERIZATION OF THE RESIN, APPLYING HEAT-EXCHANGE LIQUID IN DIRECT CONTACT WITH THE ENTIRE LOWER SURFACE OF THE FIRST MOLD PLATE AS A UNIFORM PATTERN OF SPLASHED DROPLETS TO INTIMATELY WET SAID LOWER SURFACE AND THEREBY PROVIDE PERFECT HEAT TRANSFER WITH THE RESIN EXOTHERM WHILE MAINTAINING THE HEAT-EXCHANGE LIQUID AT A TEMPERATURE TO INITIATE POLYMERIZATION AND DEVELOP THE EXOTHERM OF THE RESIN, AND THEN TRANSFERRING EXOTHERMIC HEAT OUT OF THE POLYMERIZING RESIN AND THROUGH SAID MOLD PLATES AND BACK INTO SAID HEAT-EXCHANGE LIQUID TO MAINTAIN SAID EXOTHERM AT A TEMPERATURE LEVEL BELOW THE MONOMER BOILING POINT OF SAID RESIN SYSTEM, WHEREBY SAID ENTIRE LAYER OF RESIN IS POLYMERIZED AT ONCE AND THE EXOTHERM OF POLYMERIZATION IS CONTROLLED TO PREVENT MONOMER BOIL.

References Cited (Backward Citations)

US2057674A Cited
US2057673A Cited

USPTO Annuity & Maintenance Windows

Annuity Stage Window Opens Payment Deadline Surcharge Period Until Estimated Fee Status
3.5 Years (Year 4) 1970-08-21 1971-02-20 1971-08-22 $2000.00 Window Closed / Lapsed
7.5 Years (Year 8) 1974-08-21 1975-02-20 1975-08-22 $3760.00 Window Closed / Lapsed
11.5 Years (Year 12) 1978-08-21 1979-02-20 1979-08-22 $7700.00 Window Closed / Lapsed

Assigned Categories & Tags

No categories assigned to this patent yet.

Assign Category Tag