Hermetically sealed thin film module

Claim 1

A HERMETICALLY SEALED THIN FILM ELECTRIC CIRCUIT MODULE COMPRISING: A METAL CUP WITH UPSTANDING FIXED TERMINAL PINS AND CAPACITOR BLOCKS WITHIN THE CUP, SAID TERMINAL PINS AND CAPACITOR BLOCKS BEING ELECTRICALLY INSULATED FROM SAID METAL CUP; A VITREOUS SUBSTRATE MATERIAL OF THE SAME COEFFICIENT OF THERMAL EXPANSION AS SAID METAL CUP WITHIN SAID CUP AND SEALED TO SAID CUP, SAID TERMINAL PINS, AND SAID CAPACITOR BLOCKS BY VITREOUS-TO-METAL MOLECULAR SEALS WITH OPPOSITE ENDS OF EACH TERMINAL PINS AND THE CAPACITOR BLOCK EXPOSED AND WITH ONE FACE OF SAID VITREOUS SUBSTRATE ON THE OPEN SIDE OF SAID METAL CUP BEING OPTICALLY FLAT; THIN FILM DEPOSITED CIRCUITRY INCLUDING THIN FILM RESISTORS AND DIODES ON SAID OPTICALLY FLAT SURFACE OF SAID VITREOUS SUBSTRATE CONNECTING ONE OF THE EXPOSED ENDS OF SAID TERMINAL PINS AND CAPACITOR BLOCKS AND DISCRETE ACTIVE ELEMENTS RESISTANCE WELDED TO SAID ONE ENDS OF SAID TERMINAL PINS, THE OTHER ENDS OF SAID TERMINAL PINS HAVING MEANS FORMING A MULTIPLE CONNECTOR; AND A METAL COVER OF THE SAME COEFFICIENT OF THERMAL EXPANSION AS SAID METAL CUP FIXED TO SAID CUP BY METALLIC FUSION TO SAID CUP WITH AN INERT GAS THEREIN TO HERMETICALLY SEAL SAID THIN FILM CIRCUITRY IN THE GAS ENVIRONMENT WITHIN SAID CUP AND COVER WHEREBY A THIN FILM PLUG-IN TYPE MODULE IS PROVIDED.