US3303078A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Method of making electrical components
Assignee: Individual
•
Filing: 1962-05-18
•
Granted: 1967-02-07
•
Expires: 1982-05-18
Abstract
No abstract record available.
Inventors
- 👤 Milton D Rubin
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-05 00:43
CPC Classifications
H; H05; H05K; H05K1/00; H05K1/16; H05K1/167; H05K1/02; H05K1/09; H05K1/092; H05K1/095; H05K2201/00; H05K2201/01; H05K2201/0104; H05K2201/0116; H05K2201/03; H05K2201/0332; H05K2201/0335; H05K2201/0355; H05K2203/00; H05K2203/03; H05K2203/0338; H05K2203/0369; H05K2203/0376; H05K2203/13; H05K2203/1333; H05K2203/135; H05K3/00; H05K3/02; H05K3/06
Claims Analysis
Total Claims: 2
Claim 1
Independent Claim
140 words
A METHOD OF FORMING PRINTED CIRCUITS HAVING COMPONENTS INTEGRALLY FORMEDTHERIN, COMPRISING FORMING A LAMINATE OF AN IMPREGNABLE POROUS DIELECTRIC LAYER AND A CONDUCTIVE LALYER INTEGRALLY BONDED TO ONE SURFACE OF SAID IMPREGNABLE DIELECTRIC LAYER, MASKING SELECTED PORTIONS OF SAID DIELECTRIC LAYER ON THE SURFACE OPPOSITE SAID CONDUCTIVE LAYER THEREBY FORMING UNMASKED AREAS CONFORMING TO THE DESIRED SHAPE OF SAID COMPONENTS, DEPOSITING IN SAID AREAS A SELECTED AMOUNT OF RESTRICTIVE MATERIAL INTO INTIMATE CONTACT WITH SAID DIELECTRIC LAYER AND ALLOWING SAID RESISTIVE MATERIAL TO PERMEATE SAID DIELECTRIC LAYER AND ELECTRICALLY CONTACT SAID CONDUCTIVE LAYER, REMOVING SAID MASK, IMPREGNATING SAID DIELECTRIC LAYER WITH A LAYER OF PLASTIC RESIN, AND REMOVING SELECTED PORTIONS OF SAID CONDUCTIVE LAYER TO FORM A CIRCUIT WITH SAID RESISTIVE MATERIAL IN SAID AREAS INCLUDED IN SAID CIRCUIT AND CONTACTED BY OTHER UNREMOVED SELECTED PORTIONS OF SAID CONDUCTIVE LAYER.
Claim 2
Independent Claim
140 words
A METHOD OF FORMING PRINTED CIRCUITS HAVING COMPONENTS INTEGRALLY FORMEDTHERIN, COMPRISING FORMING A LAMINATE OF AN IMPREGNABLE POROUS DIELECTRIC LAYER AND A CONDUCTIVE LALYER INTEGRALLY BONDED TO ONE SURFACE OF SAID IMPREGNABLE DIELECTRIC LAYER, MASKING SELECTED PORTIONS OF SAID DIELECTRIC LAYER ON THE SURFACE OPPOSITE SAID CONDUCTIVE LAYER THEREBY FORMING UNMASKED AREAS CONFORMING TO THE DESIRED SHAPE OF SAID COMPONENTS, DEPOSITING IN SAID AREAS A SELECTED AMOUNT OF RESTRICTIVE MATERIAL INTO INTIMATE CONTACT WITH SAID DIELECTRIC LAYER AND ALLOWING SAID RESISTIVE MATERIAL TO PERMEATE SAID DIELECTRIC LAYER AND ELECTRICALLY CONTACT SAID CONDUCTIVE LAYER, REMOVING SAID MASK, IMPREGNATING SAID DIELECTRIC LAYER WITH A LAYER OF PLASTIC RESIN, AND REMOVING SELECTED PORTIONS OF SAID CONDUCTIVE LAYER TO FORM A CIRCUIT WITH SAID RESISTIVE MATERIAL IN SAID AREAS INCLUDED IN SAID CIRCUIT AND CONTACTED BY OTHER UNREMOVED SELECTED PORTIONS OF SAID CONDUCTIVE LAYER.
References Cited (Backward Citations)
US2138938A
Cited
US2662957A
Cited
GB728219A
Cited
US2680699A
Cited
US2884571A
Cited
US3115423A
Cited
US2970064A
Cited
US3053929A
Cited
US3167490A
Cited
US3037923A
Cited
US3061911A
Cited
US3094477A
Cited
US3211639A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1970-02-06 | 1970-08-08 | 1971-02-07 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1974-02-06 | 1974-08-08 | 1975-02-07 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1978-02-06 | 1978-08-08 | 1979-02-07 | $7700.00 | Window Closed / Lapsed |