Abstract 1,010,016. Welding by pressure; shearing. SIEMENS & HALSKE A.G. July 15, 1964 [July 23, 1963], No. 29287/64. Headings B3R and B3W. [Also in Division H1] A method of attaching a wire 6 to a semiconductor (not shown) by heat and pressure comprises feeding the wire through a nozzle 5 by which it is pressed against the semi-conductor, and severing the attached wire by shearing blades 8, 9, the blade 8 having a cutting edge located intermediate its thickness and a cam surface 15 for bending over the end of wire remaining in the nozzle so as to prepare the wire for a further attaching operation. When the cutting edges meet, a further cam surface 13 on blade 8 deflects the blade 9, Fig. 6, causing it to pass beneath blade 8. A block 14 guides and/or limits movement of the blade, through contact with the nozzle. The block 14 may be interchangeable or adjustable in order to vary the severance plane. The nozzle 5 may be of glass and the wire 6 of gold.
IN A DEVICE FOR BONDING A CONTACT WIRE TO A SEMICONDUCTOR MEMBER BY THERMOCOMPRESSION, GUIDE NOZZLE MEANS FOR SUPPLYING A CONTACT WIRE, AND TRIMMING MEANS INCLUDING A PAIR OF SHEAR BLADES SPACED FROM SAID NOZZLE MEANS AND HAVING A CUTTING PLANE LOCATED TRANSVERSELY TO THE AXIS OF THE WIRE, SAID BLADES BEING NORMALLY SET TO ABUT AGAINST EACH OTHER BUT BEING ELASTICALLY YIELDABLE PERPENDICULARLY TO SAID CUTTING PLANE INTO AN OVERLAPPING RELATION FOR TRIMMING THE WIRE TO A GIVEN LENGTH OF WHICH THE WIRE PORTION BETWEEN THE CUTTING PLANE AND SAID NOZZLE MEANS IS SHORTER THAN THE SUM OF THE WIRE DIAMETER AND THE THICKNESS OF ONE OF SAID BLADES AND FOR SIMULTANEOUSLY IMPARTING TO THE EXTREME END PORTION OF THE WIRE A LATERAL BEND OF A PREDETERMINED SHORT LENGTH READILY ATTACHABLE TO A SEMICONDUCTOR MEMBER OF RELATIVELY SMALL ATTACHING AREA.