Method of soldering semiconductor discs

Claim 1

THE IMPROVED METHOD COMPRISING THE STEPS OF FORMING A BISMUTH TELLURIDE DISC WITH A PERIPHERAL FACE AND A FLAT END FACE; ROUNDING THE EDGE BETWEEN THE FLAT END FACE AND PERIPHERAL FACE SO THAT SAID EDGE HAS A DISCERNIBLE RADIUS OF CURVATURE; NICKEL PLATING THE FLAT END FACE AND THE ROUNDED EDGE; FORMING AN ALUMINUM CONDUCTOR WITH A FLAT FACE; JOINING THE FLAT FACES OF THE SEMICONDUCTOR DISC AND CONDUCTOR WITH A LAYER OF SOLDER; HEATING THE ALUMINUM CONDUCTOR PRIOR TO ITS BEING JOINED TO THE SEMICONDUCTOR; COATING THE CONDUCTOR FLAT FACE WITH A TIN-ZINC ALLOY SOLUTION WHILE IT IS HEATED; COVERING THE COATED FLAT FACE WITH A LEAD-TIN COATING WHILE THE TIN-ZINC SOLUTION IS IN A FLUID STATE; AND COOLING THE ALUMINUM CONDUCTOR PRIOR TO JOINING THEREOF WITH THE SEMICONDUCTOR.