Semiconductor device with pressure maintained non-bonded connectors

Claim 1

AN ELECTRONIC SEMICONDUCTOR DEVICE COMPRISING A PLATE-SHAPED AND ESSENTIALLY MONOCRYSTALLINE SEMICONDUCTOR BODY, A METAL PLATE ALLOY BONDED TO ONE FLAT SIDE OF SAID BODY IN FACE-TO-FACE AREA ENGAGEMENT THEREWITH AND HAVING A THERMAL COEFFICIENT OF EXPANSION SUBSTANTIALLY SIMILAR TO THAT OF SAID BODY, PRESSURE CONTACT MEANS HAVING A CONTACT MEMBER, SAID PLATE AND SAID CONTACT MEMBER HAVING RESPECTIVE INDEPENDENT SURFACES IN MECHANICAL PRESSURE ENGAGEMENT WITH EACH OTHER IN AN AREA AT LEAST NEARLY AS LARGE AS SAID BONDED AREA BETWEEN SAID PLATE AND SAID SEMICONDUCTOR BODY, ONE OF SAID TWO CONTACT SURFACES CONSISTING OF A NOBLE METAL AND THE OTHER SURFACE CONSISTING OF A DIFFERENT METAL NON-ALLOYING RELATIVE TO SAID NOBLE METAL, AT LEAST ONE OF SAID TWO SURFACES BEING UNIFORMLY ROUGH AND HAVING A ROUGHNESS DEPTH BETWEEN 0.5 AND 50 MICRONS, EACH OF SAID TWO CONTACT SURFACES BEING SUBSTANTIALLY PLANAR AND HAVING ANY DEPARTURE OF ITS MEDIAN SURFACE IN EITHER DIRECTION FROM A GEOMETRIC PLANE WITHIN THE LIMIT OF SAID ROUGHNESS DEPTH.