Water cooled semiconductor device assembly

Claim 1

A MOUNTING STRUTURE FOR A SEMICONTUCTOR DEVICE; SAID MOUNTING STRUCTURE COMPRISING A CONDUCTIVE MOUNTING BODY ELECTRICALLY AND THERMALLY CONNECTED TO SAID SEMICONDUCTOR DEVICE AND HAVING A RELATIVELY LARGE, FIRST CLAMPING SURFACE, A CONDUCTIVE BUS SUPPORT HAVING A RELATIVELY LARGE AREA SECOND CLAMPING SURFACE POSITIONED ADJACENT SAID FIRST CLAMPING SURFACE OF SAID CONDUCTIVE MOUNTING BODY, A THIN INSULATION SHEET INTERPOSED BETWEEN AND COEXTENSIVE WITH SAID FIRST AND SECOND CLAMPING SURFACES, AND CLAMPING MEANS FOR CLAMPING SAID CONDUCTIVE MOUNTING BODY OF SAID CONDUCTIVE SUPPORT; SAID RELATIVELY LARGE FIRST AND SECOND CLAMPING SURFACES AND SAID RELATIVELY THIN INSULATOR SHEET DEFINING A LOW THERMAL IMPEDANCE TO HEAT FLOW BETWEEN SAID CONDUCTIVE MOUNTING BODY AND SAID CONDUCTIVE BUS SUPPORT; AT LEAST ONE OF SAID FIRST OR SECOND CLAMPING SURFACE BEING NORMALLY CONVEX TOWARD THE OTHER OF SAID FIRST AND SECOND CLAMPING SURFACE; SAID CLAMPING MEANS DISTORTING SAID NORMALLY CONVEX CLAMPING SURFACE OF SAID ONE OF SAID FIRST OR SECOND CLAMPING SURFACES TO CONFORM TO THE SHAPE OF THE SURFACE OF THE OTHER OF SAID FIRST OR SECOND CLAMPING SURFACES.