Modular electronic package

Claim 1

A MODULAR ELECTRONIC PACKAGE COMPRISING, A GENERALLY RECTANGULAR OPEN-SIDED FRAME, A PAIR OF COVER PLATES SECURED TO THE OPEN SIDES OF THE FRAME AND FORMING AN ENCLOSED HOUSING, AT LEAST ONE OF SAID PLATES BEING THERMALLY CONDUCTIVE AND REMOVABLE FROM SAID FRAME FOR ACCESS INSIDE SAID HOUSING, A SUBSTANTIALLY RIGID PRINTED CIRCUIT BOARD SECURED TO SAID FRAME WITHIN THE HOUSING AND FORMING A PARTITION THEREIN, A PLURALITY OF ELECTRONIC COMPONENT MODULES REMOVABLY SECURED TO SAID PRINTED CIRCUIT BOARD ON ONE SIDE THEREOF AND ELECTRICALLY INTERCONNECTED THEREWITH TO PROVIDE A USEFUL CIRCUIT, A FLEXIBLE PRINTED CIRCUIT CABLE SECURED TO SAID PRINTED CIRCUIT BOARD ON THE OPPOSITE SIDE THEREOF AND PROVIDING ELECTRICAL INPUT AND OUTPUT CONDUCTORS FOR THE CIRCUIT, AND RESILIENT WOVEN METAL HEAT CONDUCTIVE STRIPS SECURED TO SAID ONE PLATE AND ENGAGING SAID COMPONENT MODULES TO RESTRAIN THE LATTER AGAINST MOVEMENT AND TO TRANSMIT BY CONDUCTION INTERNALLY GENERATED HEAT FROM THE MODULES TO SAID PLATE FOR DISSIPATION OF SAID HEAT EXTERIOR OF THE HOUSING.